| 研究生: |
王家威 Jia-Wei Wang |
|---|---|
| 論文名稱: |
界面活性劑改善玻璃微孔電化學放電成形精度的影響 Effects of the surfactant additive improves the shape accuracy of the Micro-hole of the glass |
| 指導教授: |
顏炳華
Biing-Hwa Yan |
| 口試委員: | |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 機械工程學系 Department of Mechanical Engineering |
| 畢業學年度: | 94 |
| 語文別: | 中文 |
| 論文頁數: | 66 |
| 中文關鍵詞: | 玻璃加工 、電化學放電加工 |
| 外文關鍵詞: | glass machining, ECDM |
| 相關次數: | 點閱:13 下載:0 |
| 分享至: |
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摘要
電化學放電加工被運用來加工陶瓷材料,但大多的研究上皆採用直流電為能量的輸入型態,以致微孔的入口處會有嚴重的擴孔現象,材料甚至會因連續的放電火花而產生微裂痕。因此本文以變化電極幾何形狀搭配脈衝電壓為電化學放電加工時的能量輸入形態,並結合界面活性劑在硼矽玻璃上鑽微孔,探討加工後微孔的形狀精度、尺寸及加工時間。
實驗結果發現,將直徑200μm之圓柱電極改成扁平電極,入口擴孔量有20%的改善率;接著,在電解液中添加界面活性劑,在添加的最佳濃度20ppm狀況下,微孔擴孔量的改善率可提昇至28%,但在加工時間上並無明顯改善。
最後以扁平電極搭配脈衝電壓為電化學放電加工時的能量輸入形態,並結合添加界面活性劑於電解液中,入口的擴孔量相較於最初以圓柱電極採用DC直流電壓輸入所鑽的微孔,有非常明顯的改善,且微孔的表面型態也獲得良好的改善。當在脈衝供給時間比脈衝休止時間比為2ms:1ms時達到最好,擴孔量改善率達60%,且加工時間可由86.6秒降至55秒。
Abstract
Most of the research used the rectified DC voltage to machine the micro-hole on the Borosilicate Glass in ECDM process. One of the drawbacks is seriously inlet reaming. Extremely, the material will form micro-crack because of continuously discharge spark. This study investigate the shape accuracy and size of the micro-hole and the machining time with changing the electrode geometry, finding the best switch on and switch off time ratio, and adding surfactant into the dielectric.
The experimental results show that the reaming of the micro-hole decrease 20% by changing cylinder electrode into flat side wall electrode, 28% by adding the best surfactant concentration combined the flat side wall electrode.
Finally, the flat side wall electrode combine the pulse voltage and add surfactant into dielectric. The result shows the distinct improvement in the inlet reaming and the machine time
六、參考文獻
1.R.Wuthrich and V.Fasio,Machining of non-conducting materials using electrochemical discharge phenomenon ---- an overview,International Journal of Machine Tool & Manufacture,(2005) 1-14.
2.Kurafuji and K. Suda, Electrical discharge drilling of glass, Annals of the CIRP ,16 (1968) 415–419.
3.I. Basak and A.Ghosh, Mechanism of spark generation during electrochemical discharge machining: a theoretical model and experimental verification, Journal of Material Processing Technology,62(1996) 46-53.
4.I. Basak and A.Ghosh, Mechanism of material removal in electrochemical discharge machining : a theoretical model and experimental verification, Journal of Material Processing Technology ,71(1997) 350-359.
5.V. K. Jain, P. M. Dixit, and P.M. Pandey, On the Analysis of Electro Chemical Spark Machining Process, International Journal of Machine Tools & Manufacture, (1999)165-186.
6.B. Bhattacharyya, B. N. Doloi, and S. K. Sorkhel ,Experimantal analysis an the electrochemical conference on precision engineering, ICPE, Taipei, Taiwan, (1997)715720.
7.C.T. Yan, S.S. Ho, and B.H. Yan, Micro hole machining of borosilicate glass trough electrochemical discharge machining (ECDM), Key Engineering Materials, 196 (2001) 149–166.
8.V.Fascio, R.Wuthrich, and H.Bleular, Spark assisted chemical engraving in the light of electrochemistry, Electrochimica Acta, 49(2004)3997-4003.
9.V. K. Jain, P. S. Rao, S. K. Chowdhury, and K. O. Rajurkar, Expermental investigations into wire electrochemical spark machining(TW-ECSM), Trans. ASME Journal of Engineering of Industry, 113 (1991) 75.
10. B. Bhattacharyya, B. N. Doloi, S. K. Sorkhel,and Mitra, Experimental investigations into electrochemical discharge machining(ECDM) of non-conductive ceramic materials, Journal of Materials Processing Technology, 95 (1999) 145.
11. V. K. Jain, S. K. Choudhury,and K. M. Ramesh, On the machining of alumina and glass, International Journal of Machine Tools and Manufacture, 42 (2002) 1269.
12. H. Langen, R. Wuthrich, V. Fascio,and D. Viquerat, Study of spark assisted chemical engraving-process technology date, Proceeding of International Conference of the European Society for Precision Engineering and Nanotechnology(EUSPEN) Einhoven, (2002)265.
13. B. Bhattacharyya, B. N. Doloi,and S. K. Sorkhel, Experimantal investigation into electrochemical discharge machining (ECDM) of non-conductive ceramic material, Journal of Material Processing Technology, 95(1999)145-154.
14.何世賢 著,“玻璃材料之電化學放電加工特性研究’’ ,國立中央大學碩士論文,1999
15.吳添益 著,“靜態電化學放電加工機制研究’’ ,國立中山大學機械與機電工程學系碩士論文,2004
16.曾俊文 著,“異形電極的微孔電化學放電加工特性研究’’ ,國立中央大學碩士論文,2005
17.趙承琛 著,“界面科學基礎’’,復文書局
18.Chii-Rong Yang, Po-Ying Chen, Yuang-Cherng Chiou,and Rong-Tsong Lee, Effects of mechanical agitation and surfactant additive on silicon anisotropic etching in alkaline KOH solution, Sensors and Actuators, (2004) .