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研究生： 許玉山
Yu-shan Hsu
論文名稱： 硼矽玻璃的磁場輔助電化學放電加工技術研究
A study on improvement Pyrex glass machinability by using magnetism assisted electrochemical discharge machining
指導教授： 顏炳華
Biing-Hwa Yan
黃豐元
Fuang-Yuan Huang
口試委員:
學位類別： 碩士
Master
系所名稱： 工學院 - 機械工程學系
Department of Mechanical Engineering
畢業學年度： 96
語文別： 中文
論文頁數： 90
中文關鍵詞： 電化學放電加工 、Pyrex玻璃 、氣泡層 、絕緣氣膜層 、磁場 、微孔品質
外文關鍵詞： magnetism, insulation gas film, bubble, ECDM, Pyrex glass
相關次數： 點閱：12  下載：0 
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    • 本實驗主要研究磁力輔助對電化學放電加工(Electrochemical Discharge Machining, ECDM)非導體元件之硼矽玻璃(Pyrex)的成形精度與穩定性探討，電化學放電加工可運用於非導電硬脆材料的加工上，但在實際製程的應用上，其輪廓及尺寸精度控制乃ECDM製程實用化之關鍵門檻，而與製程精度及重現性有直接關係的是放電電流密度與放電火花分布特性，其中最主要的影響因子為氣泡層的幾何外形與尺寸，及絕緣氣膜層的穩定性。本研究針對絕緣氣膜層之成長機制，及其所對應的加工精度與穩定性做一系列的探討與分析。
    實驗結果顯示，當電壓能量為38 V、電解液濃度為6 M時將圓柱電極改為扁平電極能使微孔的加工品質有較佳的改善效果，其擴孔量有4 %的改善率。最後再增加輔助磁場進行加工，結果發現在穩定的放電電流狀態下，其微孔可獲得極佳的品質改善效果，擴孔量有26.7 %的改善率，加工效率也能有效的提升72 %。

    Electrochemical Discharge Machining (ECDM) can be use for manufacture non-conductors brittle material, but the forming contours and dimension precision will effect industry application, a purpose on improve Pyrex glass forming precision and stability, using magnetism assisted in the experiment is new technology for ECDM. In the study, we find the discharge current density and spark distributable will effect forming precision and reliability but the most important key point is bubble geometry and dimension which will influence the stability of insulation gas film.
    According to the result, when voltage arrival 38 V、electrolyte concentrate at 6 M, and change electrode geometry from cylindrical tool to flat sidewall-flat front tool can improve microhole reaming arrival 4 %, and than combination of magnetism to increase the machining precision and reliability, improve microhole reaming achieve 26.7 %, machining efficiency achieve 72 %.

    摘 要 i 目 錄 iii 圖目錄 vi 表目錄 ix 第一章 緒論 1 1-1 研究動機 1 1-2文獻回顧 4 1-3 研究目的 11 第二章 基本原理 13 2-1 ECDM配置 13 2-2 ECDM的電化學反應 15 2-3 ECDM的放電火花產生過程 17 2-4 ECDM的材料去除機制 19 2-5 線放電研磨加工原理 22 第三章 實驗材料、設備與步驟 27 3-1 實驗材料 27 3-1-1 電解液 27 3-1-2 碳化鎢電極 28 3-1-3 石墨輔助電極 29 3-1-4 硼矽玻璃 29 3-1-5 釹鐵錋磁鐵 31 3-2 實驗設備 35 3-2-1 電化學放電加工設備 35 3-2-2 電極修整設備 37 3-2-3 電源供應器 39 3-2-4 顯微量測系統 40 3-2-5 去離子水系統 40 3-2-6 超音波洗淨機 41 3-2-7 掃描式電子顯微鏡 42 3-2-8 示波器 42 3-2-9 電流測試探棒 43 3-2-10 表面真空蒸鍍機 43 3-2-11 精密電子天平 44 3-3 實驗流程 45 3-4 實驗參數設定 46 3-5 實驗步驟 47 3-5-1 碳化鎢電極修整 47 3-5-2 電解液濃度之調配 51 3-5-3 ECDM機構設備的調整 51 3-5-4 輸入不同實驗參數值 51 3-5-5 試片清洗 51 3-5-6 孔徑表面觀察 52 第四章 結果與討論 53 4-1 電壓能量於氣膜結構與加工精度之影響 55 4-2 電解液濃度之轉折電壓與加工特性 62 4-3 加工深度對ECDM加工品質的影響 66 4-4 輔助磁場對ECDM加工品質的影響 76 第五章 結論 85 第六章 參考文獻 86

    〔1〕H. Kurafuji and K. Suda, “Electrical discharge drilling of glass”, Annals of the CIRP, Vol. 16, p. 415, 1968.
    〔2〕V. Raghuram, T. Pramila, Y.G. Srinivasa, K. Narayanasamy, “Effect of the circuit parameters on the electrolytes in the electrochemical discharge phenomenon”, Journal of Material Processing Technology, Vol. 52, p.301, 1995.
    〔3〕I. Basak and A. Ghosh, “Mechanism of spark generation during electrochemical discharge machining: a theoretical model and experimental verification”, Journal of Material Processing Technology, Vol. 62, p. 46, 1996.
    〔4〕B. Bhattacharyya, B.N. Doloi, S.K. Sorkhel, “Experimental investigations into electrochemical discharge machining (ECDM) of non-conductive ceramic materials”, Journal of Materials Processing Technology, Vol. 95, p. 145, 1999.
    〔5〕V. Fascio, R. Wüthrich, D. Viquerat, H. Langen, “3D microstructuring of glass using electrochemical discharge machining (ECDM)”, Micromechatronics and Human Science, p. 179, 1999.
    〔6〕H. Langen, V. Fascio, R. Wüthrich, D. Viquerat, “Three-dimensional microstructuring of Pyrex glass wafers by spark-assisted chemical etching”, Microrobotics and Microassembly, Vol. 4568 , 2001.
    〔7〕M. Schöpf, I. Beltrami, M. Boccadoro, D. Kramer, “ECDM(Electro Chemical Discharge Machining), a New Method for Trueing and Dressing of Metal Bonded Diamond Grinding Tools”, CIRP Annals - Manufacturing Technology, Vol. 50, p. 125 , 2001.
    〔8〕A.G. Mamalis, J. Kundrák, K. Gyáni, “The significance of continuous dressing in precision grinding of hard and brittle materials”, Materials and Manufacturing Process, Vol. 16, p. 341, 2001.
    〔9〕H.J. Lim, Y.M. Lim, S.H. Kim and Y.k. Kwak, “Self-aligned micro tool and electrochemical discharge machining (ECDM) for ceramic materials”, Optical Engineering for Sensing and Nanotechnology, Vol. 4416, p. 348, 2001.
    〔10〕C.T. Yang, S.S. Ho, B.H. Yan and F.Y. Huang, “Micro hole machining of borosilicate glass trough electrochemical discharge machining (ECDM)”, Key Engineering Materials, Vol. 196, p. 149, 2001.
    〔11〕V. Fascio, H.H. Langen, H. Bleuler, Ch. Comninellis, “Investigations of the spark assisted chemical engraving”, Electrochemistry Communications, Vol. 5, p. 203, 2003.
    〔12〕W.Y. Peng, Y.S. Liao, “Study of electrochemical discharge machining technology for slicing non-conductive brittle materials”, Journal of Material Processing Technology, Vol. 149, p. 363, 2004.
    〔13〕R. Wüthrich, H. Bleuler, “A model for electrode effects using percolation theory”, Electrochimica Acta, Vol. 49, p. 1547, 2004.
    〔14〕V. Fascio, R. Wüthrich, H. Bleuler, “Spark assisted chemical engraving in the light of electrochemistry”, Electrochimica Acta, Vol. 49, p. 3997, 2004.
    〔15〕E.S. Lee, D. Howard, E. Liang, S.D. Collins and R.L. Smith, “Removable tubing interconnects for glass-based micro-fluidic systems made using ECDM”, Journal of Micromechanics and Microengineering, Vol. 14, p. 535, 2004.
    〔16〕R. Wüthrich, V. Fascio, “Machining of non-conducting materials using electrochemical discharge phenomenon ― an overview”, International Journal of Machine Tools & Manufacture, Vol. 45, p. 1095, 2005.
    〔17〕R. Wüthrich, Ch. Comninellis, H. Bleuler, “Bubble evolution on vertical electrodes under extreme current densities”, Electrochimica Acta, Vol. 50, p. 5242, 2005.
    〔18〕R. Wüthrich, K. Fujisaki, Ph. Couthy, L.A. Hof and H. Bleuler, “Spark assisted chemical engraving (SACE) in microfactory”, Journal of Micromechanics and Microengineering, Vol. 15, p. 276, 2005.
    〔19〕R. Wüthrich, L.A. Hof, A. Lal, K. Fujisaki, H. Bleuler, Ph. Mandin and G. Picard, “Physical principles and miniaturization of spark assisted chemical engraving (SACE)”, Journal of Micromechanics and Microengineering, Vol. 15, p. 268, 2005.
    〔20〕R. Wüthrich, L.A. Hof, “The gas film in spark assisted chemical engraving(SACE) ― A key element for micro-machining applications”, International Journal of Machine Tools & Manufacture, Vol. 46, p. 828, 2006.
    〔21〕D.J. Kim, Y. Ahn, S.H. Lee, Y.K. Kim, “Voltage pulse frequency and duty ratio effects in an electrochemical discharge microdrilling process of Pyrex glass”, International Journal of Machine Tools & Manufacture, Vol. 46, p. 1064, 2006.
    〔22〕R. Wüthrich, U. Spaelter and H. Bleuler, “The current signal in spark-assisted chemical engraving(SACE): what does it tell us?” Journal of Micromechanics and Microengineering, Vol. 16, p. 779, 2006.
    〔23〕C.T. Yang, S.L. Song, B.H. Yan, F.Y. Huang, “Improving machining performance of wire electrochemical discharge machining by adding Sic abrasive to electrolyte”, International Journal of Machine Tools & Manufacture, Vol. 46, p. 2044, 2006.
    〔24〕R. Wüthrich, U. Spaelter, Y. Wu and H. Bleuler, “A systematic characterization method for gravity-feed micro-hole drilling in glass with spark assisted chemical engraving (SACE)”, Journal of Micromechanics and Microengineering, Vol. 16, p. 1891, 2006.
    〔25〕R. Wüthrich, B. Despont, P. Maillard and H. Bleuler, “Improving the material removal rate in spark-assisted chemical engraving (SACE) gravity-feed micro-hole drilling by tool vibration”, Journal of Micromechanics and Microengineering, Vol. 16, N 28, 2006.
    〔26〕M.E. Sandison, M. Zagnoni, M. Abu-Hantash and H. Morgan, “Micromachined glass apertures for artificial lipid bilayer formation in a microfluidic system”, Journal of Micromechanics and Microengineering, Vol. 17, S 189, 2007.
    〔27〕P. Maillard, B. Despont, H. Bleuler, R. Wüthrich, “Geometrical charaterization of micro-holes drilled in glass by gravity-feed with spark assisted chemical engraving (SACE)”, Journal of Micromechanics and Microengineering, Vol. 17, p. 1343, 2007.
    〔28〕M.S. Han, B.K. Min, S.J. Lee, “Improvement of surface integrity of electro-chemical discharge machining process using powder-mixed electrolyte”, Journal of Materials Processing Technology, Vol. 191, p. 224, 2007.
    〔29〕B.H. Yan, C.T. Yang, F.Y. Huang and Z.H. Lu, “Electrophoretic deposition grinding (EPDG) for improving the precision of microholes drilled via ECDM”, Journal of Micromechanics and Microengineering, Vol. 17, p. 376, 2007.
    〔30〕Z.P. Zheng, H.C. Su, F.Y. Huang and B.H. Yan, “The tool geometrical shape and pulse-off time of pulse voltage effects in a Pyrex glass electrochemical discharge microdrilling process”, Journal of Micromechanics and Microengineering, Vol. 17, p. 265, 2007.
    〔31〕Z.P. Zheng, W.H. Chwng, F.Y. Huang, and B.H. Yan, “3D microstructuring of Pyrex glass using the electrochemical discharge machining process”, Journal of Micromechanics and Microengineering, Vol. 17, p.960, 2007.
    〔32〕M.S. Han, B.K. Min and S.J. Lee, “Modeling gas film formation in electrochemical discharge machining process using a side-insulated electrode”, Journal of Micromechanics and Microengineering, Vol. 18, 045019, 2008.
    〔33〕王家威，「界面活性劑改散玻璃微孔電化學放電成形精度的影響」，國立中央大學碩士論文，民國九十五年。
    〔34〕鄭偉欣，「電化學放電加工硼矽玻璃之微流道成形技術研究」，國立中央大學碩士論文，民國九十六年。
    〔35〕楊景棠，「微電化學放電加工法應用於硼矽玻璃的精微加工及精度改善之研究」，國立中央大學博士論文，民國九十六年。
    〔36〕王以真，「實用磁路設計」，全華科技圖書股份有限公司，民國八十四年。

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