本研究第一部分主要針對印刷電路板(Printed Circuit Board, PCB)在前端設計、用途、製程架構、疊構、後端可靠度測試及電子測試提供論述；第二部分以介電常數值(Dielectric Constant, DK)為主軸，再以介電常數材料主要參數、介電常數值、介質損耗、熱膨脹係數及導熱性提供高頻材料選材建議；第三部分選定以無源互調(PIM)為依據作為印刷電路板微帶天線指標參考；第四部分以介電常數壓層對應不同印刷電路板微帶貼片天線尺寸作為實驗，透過無源互調策略以及不同材料受到無源互調干擾提供驗證，歸納出電路同一電路板材料製造的參考，但由於無源互調受到電流密度的影響，造成無源互調的差異非常顯著。
結論歸納出較厚的電路材料與低介電常數值組合對天線輻射是較有利的設計，但對饋線較不利，無源互調干擾對印刷電路板天線會造成問題，其影響距離近且頻率不同天線，無源互調只需要極低程度的能量就會在這些技術中造成問題，無源互調干擾主要為靈敏度造成無源互調數值-150dBc的是認知產品良好的範圍。

This paper investigates the material select for Printed Circuit Board and how do the Dielectric Constant and PIM influence on the antennas of Printed Circuit Board. There are four parts in this paper. First, we focus on the design, use, process architecture, stacking of Printed Circuit Board and the reliability testing and electronic testing of Printed Circuit Board. Second, we focus on Dielectric Constant, then provide high-frequency material suggestion base on Dielectric Constant value, Dielectric loss, thermal expansion coefficient and thermal conductivity. Third, selected based on passive intermodulation (PIM) as a reference for Printed Circuit Board antenna. Fourth, taking the Dielectric Constant layer corresponding to different antenna patch sizes as an experiment, Provides verification through passive intermodulation strategies and different materials subject to passive intermodulation interference, summarizes the reference for circuit board material manufacturing.
The results show that the combination of thicker circuit materials and low Dielectric Constant is more advantageous for antenna radiation design, but it is more disadvantageous for feeders. Passive intermodulation interference might cause problems for printed circuit board antennas. It affects the distance and frequency of different antennas. Passive intermodulation requires only a very low level of energy to cause problems in these technologies. Passive intermodulation interference is mainly Sensitivity resulting in a passive intermodulation value of -150dBc is a good range of cognitive products

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