銀粉廣泛應用於電子元件中的銀膠。但由於銀粉成本高的緣故，銅粉被研究以用來代替銀粉。然而，銅粉表面很容易在大氣中形成氧化物，而造成電阻率高於銀粉。在這項研究中，我們製備了鍍銀銅粉以改善銅粉表面會氧化的情況。首先，製備銅粉溶液和銀離子溶液並混合在一起以將銀沉積在銅粉表面上。並且，在實驗中控制光亮劑的比例。銅粉一開始的形狀為類球狀顆粒，在經過沒有光亮劑的無電鍍，本論文觀察到較少的多面體鍍銀銅粉顆粒。但在具有光亮劑的條件下我們發現了更多的多面體鍍銀銅粉顆粒。光亮劑的作用是因為光亮劑吸附在銅表面上影響鍍銀銅粉形成多面體結構。然後，我們將鍍銀銅粉配置成鍍銀銅膠，測量鍍銀銅膠的電阻率。透過這個測量，我們發現電阻率會隨著多面體顆粒數量的增加而降低。

Silver powders are widely used in electronic devices by silver paste. Because the cost of the silver powders, copper powders was used to replace the silver powders. However copper powders are very easy to be oxides in atmosphere and the resistivity higher than silver powders. In this study, we prepared silver-coated copper powder to improve. Firstly, copper solution and silver solution were prepared and mixed together to deposit the silver on copper powders. Secondly, the composition of brightener was controlled in this experiment. Originally, copper powders were spherical particles and the results showed that less polyhedral particles were observed after electroless plating without brighteners. But more polyhedral particles were found in the conditions with brighteners. The reason for the effect of brightener that brightener adsorbed on copper surface and then affected its structure. Then, we prepared silver-plated copper powder into paste and measure the resistivity of silver-coated copper paste. Through the measurement, we found that the resistivity decrease as the number of polyhedral particles increase.

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