由實驗結果得知，Si經無電鍍處理後，可得均勻鎳膜，且具有良好之附著性，而經無電鍍鎳處理之Si粉所製成之Cu/(Si)p複合材料能有效阻隔Cu、Si之反應減少Cu3Si脆性相之生成，提升Cu/(Si)p複合材料之鍵結、緻密度、抗彎強度並降低熱膨脹係數；另外， Cu/(Si)p複合材料之熱膨脹係數、抗彎強度及緻密性隨Si顆粒之體積分率增加而下降；而對於經鍍著鎳且具相同Si顆粒體積分率之Cu/(Si)p複合材料，其緻密性、熱膨脹係數及抗彎強度均隨Si顆
粒的粗化而下降。
實驗最後以Cu/(Si)p複合材料比較一般常用電子構裝用材，發現在低密度、低熱膨脹係數與高熱傳導率等方面有優異之表現，因此本實驗之材料在構裝用途上具有開發之潛力。

1.I. A. Ibrahim, F. A. Mohamed, E. J. Lavernia , " Particulate
Reinforced Metal Matrix Composites-A Review", Journal of
Materials Science, Vol.26, 1991, P.1137-1156.
2. M. K. Premkumar,W. H. Hunt,Jr. and R. R. Sawtell,”Aluminum
CompositeMaterialsfor Multichip Modules”,JOM,July
1992,24-28
3.R. R.Tummala,E.J.Rymaszewski and A. G. klopfenstein, “Microelectronics Packaging Handbook” , 2nd Edition,Chapman &
Hill,1997.
4.C.Zweben, "Metal-Matrix Composites for Electronic
Packaging", JOM , July 1992,P15-23.
5.R.R Tummala, " Ceramic and Glass-Ceramic Packaging in
1990s", J. Am. Ceramic Soc. Vol.30, No.5, 1991,P.895-908.
6.F. A. Veer,B. H. Kolster,and W. G. Burger “Diffustion in the
Cu3Si phase of the Coper-Silicon System” ,Transactions of
the Metallurgical Society of Aime ,1968,Vol 242 p.669.
7.Yoshiaki Iijima,Yoshihiro Wakabayashi “Diffusion in Copper-
rich Copper-Silicon Alloys”
MaterialsTransactions,JIM,Vol.32,No.5(1991), pp.457 to 464.
8.L.Levin,Z. Atzmon,A. Katsman,T. Werber “The mechanisms of
phase transformation in diffusion couples of the Cu-Si”
Materials Chemistry and Physics 40(1995) 56-61.
9.Masami Onishi and Hirofumi Miura “Effect of Compressive
Stress on Reaction —Diffusion in the Cu-Si System”
Trans.JIM 1977 Vol.18.
10.Sl-YEOUL JANG,SUNG-MAN LEE “Tantalum and niobium as a
diffusion barrier between copper and silicon” Journal of
Materials sicience,Materials in electronics(1996) 271-278.
11.Jung-Chao Chiou,Kuen-Chi Juang,and Mao-Chieh Chen “TiW(N)
as Diffusion Barriers Between Cu and Si” J.Electrochem.
Soc. Vol. 142,No. 7 July 1995.
12.鍾文生”無電鍍與真空吸引浸透法製造SiC粒子強化鋁基複合材料”博
士論文，國立清華大學材料工程研究所
13.W.D.Fields.R.N.Duncan,J.R.Zickgraf and The ASM Commings and
Electroless Nickel Plating ,”Electroless Nickel Plating”
Metals Handbook,9th ed.,Vol 5,(American Society for
Metals,1982)p.219
14.R.M.Lukes, “The Chemistry of the Autocatalytic Reduction of
Copper by Alkaline Formaldehyde” Plating,15,969(1964).
15. R.R Tummala, " Ceramic and Glass-Ceramic Packaging in
1990s", J. Am. Ceramic Soc. Vol.30, No.5, 1991,P.895-908.
16.Randall M. German, Karl F. Hens and John L. Johnson," Powder
Metallurgy Processing of Thermal Management Materials for
Microelectronic Applications ", The International Journal
of Powder Metallurgy, Vol.30, No.2, 1994, P205-215.
17.S.K.Kang.“Lead Free Solders for Electronic Packaging”
J.Elee. Materials,Vol.23,No.8,1994,pp 701-707
18.M.Mc.Cormack and S. Jin, Improved Mechanical Properies in
New Lead-Free Solder Alloys”J.Elec. Materials,Vol.23,
No.8,1994,pp.715-720.
19.S. Jin, “Developing Lead-Free Solders: A Challenge and
Ipportunity”IOM,july 1993,p.13
20.E. H. Kerner, “The Elastic and Thermoelastic Properties of
Composite Media” ,Process Phys. Soc.,Vol.68B,1956,p.808.
21.L. Rayleigh, “On The Influence of Obstacles Arranged in
Rectangular order upon the Properties of a Medium”, Phil.
Mag. Vol. 24,1892,pp.481.
22.P. G. Harris and M. A. Whitmore , “Alternative Solders for
Electronics Assemblies”,Circuit Word,Vol.19,No.2,1993,pp.25-
27.
23. S.K.Kang.“Lead Free Solders for Electronic Packaging”
J.Elee.Materials,Vol.23,No.8,1994,pp 701-707
24.P.Yih and D.D.L.Chung,”Copper-Matrix Molybdnum Particle
Composites Made from Copper Coated Molybdenum
Powder”,Journal of Electronic
Materials,Vol24,No.7,1995,pp.841-851.
25.ASTM Designation:C1161-90 P.329-335.
26.P.Yih and D.D.L.Chung,”Powder Metallurgy Fabrication of
Metal Matrix Composites Using Coating Fillers”, The
International Journal of Powder Metallurgy,1995,31,335-340
27.A.K. Garg, and C. DE Jonghe,”Metal-coated colloidal
particles”, Journal of Materials Science,Vol.28 ,1993,
P.3427-3432.
28. D.J. Magley, R.A. Winholtz, and K.T. Faber, “Residual
Stresses in a Two-Phase Mirocracking Ceramic”, Journal of
the American Ceramic Society, 1990, pp.1641-1644.
29. J.K. Lee, H. Tanaka, H. Kim, “Formation of Solid Solutions
Between SiC & AlN during Liquid-Phase Sintering”,
Materials Letters, Vol29,1996, pp.1-6.