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研究生: 王景弘
Jing-Hong Wang
論文名稱: Cu/Mg比與加工對Al-4.6Cu-Mg-Ag合金性質之影響
Effect of Cu/Mg Ratio and Processing on Properties of Al-4.6Cu-Mg-Ag Alloys
指導教授: 李勝隆
Sheng-Long Lee
口試委員:
學位類別: 碩士
Master
系所名稱: 工學院 - 機械工程學系
Department of Mechanical Engineering
畢業學年度: 91
語文別: 中文
論文頁數: 64
中文關鍵詞: Cu/Mg比Mg-Ag聚集加工硬化熱輥冷輥
外文關鍵詞: Cu/Mg ratio, Mg-Ag co-clusters, work hardening, cold rolling, hot rolling
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  • Al-Cu-Mg-Ag合金為一高強度鋁合金,強化相以Ω及θ’相為主,由文獻中知,當Cu/Mg比在5~10之間,析出強化相以Ω相為主;而當Cu/Mg比更高(>10)時,析出強化相以Ω相和θ’相為主,且當Ag含量高達0.6wt%時,可促進Ω相析出於鋁基地的主要滑動面{111}α上,因此可提升材料機械強度;而由於θ’相易在差排上異質成核,因此加工會促進θ’相的析出,故本研究探討主題為Cu/Mg比與加工對Al-4.6Cu-Mg-Ag合金性質之影響。
    本研究針對Al-4.6Cu-Mg-Ag(wt%)合金,設計不同Cu/Mg比(Mg含量)之二種合金,分別為A合金(Cu/Mg=20)及B合金(Cu/Mg=8.5),施以冷加工(冷輥)及熱加工(熱輥),之後於185℃下行5小時之人工時效。利用光學顯微鏡(OM)、掃描式電子顯微鏡(SEM)、穿透式電子顯微鏡(TEM)、導電度(%IACS)、微差掃描熱分析(DSC)、密度、硬度試驗、拉伸試驗等方法,探討微結構變化與材料機械性質之關係。根據實驗結果,以了解不同Cu/Mg比與加工對Al-4.6Cu-Mg -Ag合金性質之影響。
    由結果可知,增加Mg含量(Cu/Mg比下降)可促使合金在自然時效期間,Mg-Ag原子更快速形成聚集,經185℃人工時效後,更可促進Ω相和θ’相快速析出,且Mg的添加使加工硬化及固溶強化更明顯,提升機械強度,但降低延性。
    熱輥因輥壓作用,造成晶粒細化,並因壓縮而減少微縮孔且縮小微縮孔直徑,增加密度,導致機械性質提升;冷輥易產生缺陷(差排、空位等),阻礙Mg-Ag原子於室溫下的聚集,經185℃×5hr之人工時效後,減少Ω相的析出,但增加θ’相的異質成核析出,由於加工硬化現象明顯,使硬度、拉伸強度皆提升,卻不利延性。


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    謝誌………………………………………………………………………I 摘要………………………………………………………………………II 總目錄……………………………………………………………………III 圖目錄……………………………………………………………………V 表目錄……………………………………………………………………VII 壹、前言…………………………………………………………………1 一、Al-Cu-Mg-Ag合金簡介 ……………………………………………1 二、Al-Cu-Mg-Ag合金之析出強化作用 ………………………………2 三、Cu/Mg比對Al-Cu-Mg-Ag合金析出之影響…………………………3 四、加工對Al-Cu-Mg-Ag合金微結構及機械性質之影響 ……………4 1. 熱加工(hot working)………………………………………4 2. 冷加工(cold working) ……………………………………5 貳、實驗方法與步驟……………………………………………………7 一、合金配製、熱輥、冷輥及熱處理…………………………………8 1.合金配製及成份分析……………………………………………8 2.熱輥及冷輥………………………………………………………8 3.熱處理……………………………………………………………9 二、微結構分析…………………………………………………………10 1. OM金相觀察 ……………………………………………………10 2. 密度量測 ………………………………………………………10 3. 微差掃描熱分析(DSC)………………………………………10 4. 導電度(%IACS)量測……………………………………………10 5. 掃描式電子顯微鏡觀察(SEM)…………………………………11 6. 穿透式電子顯微鏡觀察(TEM)…………………………………11 三、機械性質分析………………………………………………………11 1. 硬度試驗 ………………………………………………………11 2. 拉伸試驗 ………………………………………………………11 參、結果與討論…………………………………………………………13 一、微結構分析…………………………………………………………13 1. 金相觀察 ………………………………………………………13 2. 密度量測 ………………………………………………………16 3. 微差掃描熱分析(DSC)………………………………………17 4. 導電度(%IACS)量測……………………………………………19 5. 穿透式電子顯微鏡(TEM)分析………………………………24 二、機械性質分析………………………………………………………28 1. 硬度試驗 ………………………………………………………28 2. 拉伸試驗 ………………………………………………………32 肆、結論…………………………………………………………………35 伍、參考資料……………………………………………………………36 附錄………………………………………………………………………39

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