螢光粉特性及封裝結構造成白光LED內部溫度之異常分布

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研究生：	邱仕晟 Shih-chen Chiou
論文名稱：	螢光粉特性及封裝結構造成白光LED內部溫度之異常分布 Irregular temperature distribution inside white light LED related to characteristics of phosphor and package structures
指導教授：	鍾德元 Te-yuan Chung
口試委員:
學位類別：	碩士 Master
系所名稱：	理學院 - 光電科學研究所碩士在職專班 Executive Master of Optics and Photonics
論文出版年：	2015
畢業學年度：	103
語文別：	中文
論文頁數：	79
中文關鍵詞：	發光二極體、螢光粉、溫度分布、有限元素分析
外文關鍵詞：	LED, phosphor, temperature distribution, FEA analysis
相關次數：	點閱：16 下載：0
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本論文利用發光二極體的光源特性(Light Emitting diode, LED)，建立半球殼螢光粉封裝的熱功率密度分佈數值模型，並以蒙地卡羅法(Monte Carlo method)解決其他封裝結構數值模型的應用問題。再以有限元素分析(finite element analysis, FEA)軟體模擬LED的溫度分布，針對LED操作的電功率、功率轉換效率、螢光粉的量子效率與封裝膠的熱傳導係數作參數掃描分析。最後改變封裝的幾何結構，以半球殼封裝(Remote-dome phosphor package)、圓形平板封裝(Circular plate package)、半球封裝(Half-dome phosphor package)與表面封裝(Conformal coating package)為主，探討LED的電性、封裝的材料與幾何對LED溫度分布的影響。

This research uses the properties of LED light sources to build a numerical model of the thermal power density for remote-dome phosphor package. Monte Carlo method is applied to solve the thermal power density for the other phosphor packaging method. Finite element analysis software is used after to simulate the temperature distribution of LEDs to analyze with scanning the parameters of electric power, power efficiency, and quantum efficiency of phosphor and the thermal conductivity of the adhesive used. Furthermore, the geometrical structure of the phosphor packaging is change. The packaging methods are based on remote-dome, circular plate, half-dome and conformal coating. How the temperature distribution in LEDs will affected by electric properties, packaging material and geometrical structure are discussed in this research as well.

目錄
摘要    i
Abstract    ii
致謝    iii
圖目錄    vi
表目錄    viii
第一章    緒論    1
1-1    前言    1
1-2    研究動機    3
第二章    基本原理    4
2-1    發光二極體基本原理    4
2-2    螢光粉發光原理    6
2-2-1    螢光粉之能量轉換效率    7
2-2-2    LED黃光光譜之特徵波長與等效史托克轉換效率    8
2-2-3    比爾定律(Beer’s law)    10
2-2-4    螢光粉膠體之等效吸收係數    11
2-3    LED能量轉換過程    12
2-4    熱傳遞原理    13
2-4-1    熱傳導    13
2-4-2    熱對流    14
2-4-3    熱輻射    15
2-5    螢光粉膠體之熱功率密度分布函數與熱擴散方程式    15
第三章    等效LED熱傳導模型    18
3-1    引言    18
3-2    ASAP光學設計流程    19
3-2-1    LED光學模型之物件幾何與光學參數說明    21
3-3    COMSOL有限元素分析流程    23
3-3-1    等效LED熱傳導模型設定    24
3-3-2    熱傳導模型之LED電性與熱特性參數說明    25
3-3-3    蒙地卡羅方法之螢光粉封裝熱功率密度分布適用性驗證    27
第四章    數值模擬與分析    33
4-1    引言    33
4-1-1    LED電功率參數變化之分析    33
4-1-2    熱傳導係數參數變化之分析    35
4-1-3    功率轉換效率參數變化之分析    37
4-1-4    螢光粉的量子效率參數變化之分析    40
4-2    半球殼螢光粉封裝幾何結構參數變化之分析    41
4-2-1    圓形平板螢光粉封裝幾何結構參數變化之分析    46
4-2-2    半球螢光粉封裝幾何結構參數變化之分析    50
4-2-3    螢光粉表面封裝幾何結構參數變化之分析    52
4-3    LED晶片發光面積大小對螢光粉封裝溫度之影響    54
第五章    實驗與模擬結果之分析與比較    57
5-1    引言    57
5-2    實驗架構與模擬設定    57
5-3    實驗與模擬結果分析    59
第六章    結論    61
附錄一 LED光學模型程式設計範例    64

                                

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