| 研究生: |
張芳林 Fang-Lin Chang |
|---|---|
| 論文名稱: |
快速響應反脈衝式電鍍電源系統之研製 Design and implementation of fast response for reverse-pulse plating power system |
| 指導教授: |
徐國鎧
Kuo-Kai Shyu |
| 口試委員: | |
| 學位類別: |
碩士 Master |
| 系所名稱: |
資訊電機學院 - 電機工程學系 Department of Electrical Engineering |
| 畢業學年度: | 92 |
| 語文別: | 中文 |
| 論文頁數: | 85 |
| 中文關鍵詞: | PD控制 、CPLD 、反脈衝式電鍍 |
| 外文關鍵詞: | PD control, CPLD, reverse-pulse plating |
| 相關次數: | 點閱:7 下載:0 |
| 分享至: |
| 查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
傳統電鍍皆使用直流電源進行,而電鍍通孔的孔壁無法達到均勻銅厚品質,且其過程相當耗電以及耗材料,因此本論文進行快速響應反脈衝式電鍍電源系統之研製,其主要目的是產生快速轉態反脈衝輸出電流,以供給電源給印刷電路板做電鍍通孔之用,使得通孔的孔內壁與板面的鍍銅厚度趨近1:1,並且可減少電鍍時間、改善電鍍之銅層品質與增加印刷電路板之產能。
反脈衝式電鍍電源輸出主要是利用功率級電路-全橋式轉換器實現,並且搭配CPLD控制IC做為系統控制核心,系統控制採全數位化控制。其中控制IC內部包括PWM產生、取樣命令產生、鍵盤掃描、七段顯示器掃描以及控制演算法實現…等模組化電路。本系統中可進行反脈衝電流控制與電流時間比調變。
為了得到良好的反脈衝電流響應,本論文設計一比例微分控制器來改善系統性能,進而滿足系統規格。並且透過模擬驗證控制器的可行性,再以實際硬體測試結果來驗證其效能,藉以佐證快速響應反脈衝式電鍍電源系統之可行性與實用性。
在本電鍍電源系統中,具有週期性反脈衝電流輸出:正20安培/負200安培,上升時間小於100微秒(us),因此可知,本論文所設計之系統確實可實現快速轉態反脈衝輸出電流,且可應用於印刷電路板產業。
In the traditional plating, the direct current was used to be the power supply. But the thickness of the internal wall of the plating through hole could not be plated uniformly, and the process of plating always consumed the electricity and materials. Therefore, a fast response for reverse-pulse plating power system is designed in this thesis. The purpose of this system is to produce the fast dynamic reverse-pulse output current as the plating power supply. So the ratio of copper-plating thickness between the internal wall of the plating through hole and the surface of the printed circuit board tends to one. This system also reduces the plating time, improves the copper-plating quality and increases the quantity of producing printed circuit board.
The reverse-pulse plating power system is realized by the full-bridges converter. The system is fully digitalized and the control kernel of the system is implemented by CPLD. This system can control the reverse-pulse current and modulate the ratio of current time.
In order to obtain a desirable current response, a proportional-derivative controller is designed to improve the system performance and then satisfy the system specification. The simulation results confirm the feasibility of the controller and the experimental results further demonstrate the dynamic performance.
The output range of periodic reverse-pulse current in the experimental system is between 20 A positive and 200 A negative. The rise time is less than 100 microseconds. Therefore, this system actually can realize the fast dynamic reverse-pulse output current.
[1] 林水春,印刷電路板設計與製作,全華書局,1984。
[2] 白蓉生,“反脈衝與電鍍銅”,電路版會刊,no.7,pp. 22-29,2000。
[3] A. Vermeulen, and R. V. Hofland, “A novel new pulse plating reversal current,” Printed Circuit Fabrication, vol. 25, iss. 12, pp. 30-33, 2002.
[4] R. V. Hofland, “Going in reverse,” Printed Circuit Fabrication, vol. 23, iss. 11, pp. 48-50, 2000.
[5] G. Milad, and M. Lefebvre, “PPR plating for HDI,” Printed Circuit Fabrication, vol.23, iss. 9, pp. 40-46, 2000.
[6] R. Blake, D. DeSalvo, and R. Retallick, “Pulse plating,” Printed Circuit Fabrication, vol. 23, iss. 1, pp. 32-38, 2000.
[7] R. D. Edwards, “Methodology for high aspect ratio pulse plating,” Printed Circuit Design&Manufacture, vol. 21, iss. 1, pp. 32-36, 2004.
[8] 郭永棋,“2002年台灣電路板產業之回顧與展望”,電路版會刊,no.20,pp. 55-58,2003。
[9] 朱昱學,“電路板產業環保現況與展望”,電路版會刊,no.20,pp. 59-64,2003。
[10] 白蓉生,“99年電路板採購及微切片手冊”,電路板資訊,1999。
[11] 白蓉生,“電鍍銅的過去現在與未來”,電路版會刊,no.20,pp. 6-28,2003。
[12] 曾旭廷,“電鍍用正負脈衝式電源應器之研製”,國立成功大學碩士論文,中華民國90年。
[13] 高木清,增層、多層印刷電路板技術,全華書局,2001。
[14] K. C. Yung, T. M. Yue, K. C. Chen, and K. F. Yeung, “The effects of pulse plating parameters on copper plating distribution of microvia in PCB manufacture,” IEEE Trans. Electron. Packag. Manufact., vol. 26, no. 2, pp. 106-109, 2003.
[15] 王大倫,實用電鍍學,徐氏基金會,1978。
[16] D. Voncina, and J. Nastran, “Current source for pulse plating with high di/dt and low ripple in steady state,” in Proc. IEEE Inter. Symp. on Ind. Electron., pp.753-756, Beld, Slovenia 1999.
[17] A. Leban, and D. Voncina, “Pulse current source with high dynamic,” in Proc. EUROCON 2003, vol. 2, pp.297-300, 2003.
[18] 梁適安,交換式電源供給器之理論與實務設計,全華書局,2001。
[19] N. Mohan, T. M. Undeland, and W. P. Robbins, Power Electronics: Converters, Applications, and Design. Second Edition, John Wiley & Sons, Inc., 1996.
[20] J. C. Puippe, and F. Leaman, Theory and Practice of Pulse Plating. AESF, Orlando, Florida, 1986.
[21] 葉明仁,“電鍍”,表面技術雜誌,第148期,pp. 313-321,1994。
[22] S. C. Kou, and A. Hung, “Plating of small blind vias,” IEEE Trans. Electron. Packag. Manufact., vol. 22, no. 3, pp. 202-208, 1999.
[23] 蕭如宣,個人電腦輔助數位電路設計,儒林圖書有限公司,1998。
[24] 周育德,CIC課程講義-ALTERA PC,國家晶片系統設計中心(CIC),2002。
[25] T. H. Ai, J. F. Chen, and T. J. Liang, “A random switching method for HPWM full-bridge inverter,” IEEE Trans. Ind. Electron., vol. 49, no. 3, pp. 595-597, 2002.
[26] D. W. Hart, Introduction to Power Electronics. Prentice-Hall, 1997.
[27] 陳連春,電功率MOSFET 應用技術,建興出版社,2000。
[28] Data Book. Altera Corporation, 1998.
[29] University Program Design Laboratory Package User Guide. Altera Corporation, 1997.
[30] TLC0820AC, TLC0820AI Advanced LinCMOSTM High-Speed 8-Bit Analog-to-Digital Converter Using Modified Flash Techniques, Texas Instruments Incorporated, 1994.
[31] D. D. Gajski, Principles of digital design. Prentice-Hall, 1997.
[32] N. S. Nise, Control systems engineering. Addison-Wesley, 1995.
[33] B. C. Kuo, Automatic control systems. John Wiley & Sons, 1995.
[34] F. J. Lin, and C. M. Liaw, “Control of indirect field-oriented induction motor drives considering the effects of dead-time and parameter variations,” IEEE Trans. Ind. Electron., vol. 40, no. 5, pp. 486-495, 1993.
[35] 林志一、曾龍圖,IsSpice Version 8 交談式電路模擬分析與應用,全華書局,1998。