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研究生： 洪榮洲
Jung-Chou Hung
論文名稱： 微放電複合製程之微型工具製作技術及其精微加工研究
A study on micro-tools fabrication in micro-EDM hybrid process for micro-machining
指導教授： 顏炳華
Biing-Hwa Yan
口試委員:
學位類別： 博士
Doctor
系所名稱： 工學院 - 機械工程學系
Department of Mechanical Engineering
畢業學年度： 95
語文別： 中文
論文頁數： 142
中文關鍵詞： 複合電鍍 、超音波振動 、微放電加工 、微型工具 、複合製程 、微孔 、微模穴
外文關鍵詞： co-deposition, ultrasonic vibration, micro-EDM, hybrid process, micro-tool, micro-hole, micro-cavity
相關次數： 點閱：17  下載：0 
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    • 微放電加工法是以高精度、微加工量、微小且穩定能量，加工微小且形狀複雜或具有特殊機械性質之難加工導電材料的一種有效方法。但微放電加工後，由於工具電極的消耗會使加工後之微結構形成錐度狀，且加工表面會形成再凝固層、微裂痕與放電坑，造成形狀精度不佳。再加上無法以一般傳統研磨加工法對微結構進行精修加工，因此本研究提出新式微放電複合製程精修加工技術，並發展出製作圓柱狀與圓球型等微型工具成形技術，可有效應用於精微模具加工而使模具達到高精度與高品質的表面形狀精度，以符合工業所需。
    本研究提出兩種複合製程技術，分別為微工具搭配超音波振動游離磨粒之研磨技術，以及複合電鍍嵌入式磨粒後的微工具成形技術並探討其精微加工特性。首先針對微放電後之微圓孔與方形微孔進行研磨精修加工。實驗結果顯示，採用螺旋電極研磨法或微型圓柱狀研磨工具加工法，微細圓孔孔壁表面均可獲得顯著的精修效果；螺旋電極搭配超音波振動研磨法加工約25分鐘後，表面粗糙度值由研磨前之Rmax 1.35 μm降低至0.58 μm，而採用複合電鍍鎳-碳化矽後的微型圓柱狀工具加工時，表面粗糙度值可由研磨前之Rmax 1.47μm降低至0.46 μm。針對方形微孔而言，採用方柱狀工具搭配超音波振動研磨法，當加工45分鐘後表面粗度值Rmax可由0.96 μm降至0.31 μm。另外，對於微型球面模穴加工則是利用電極末端放電形成微球後，經複合電鍍鎳-鑽石後之微球型工具進行加工測試，可加工出一球面模穴，若搭配游離磨粒加工時，更可獲得Rmax 0.35 μm的微模穴表面。

    The micro-EDM can be used to machine complex shape conductive hard-to-machine materials with high precision, less material remove rate, micro stable energy. However, micro-EDM will cause recast layer, discharge craters and micro-cracks on the machined surface with poor surface quality. This affects the precision of diameter and the geometric shape. Moreover, the electrode wear not only will the dimension of the machined structure be changed, but also its shape is severely distorted. Unfortunately, the conventional grinding is difficult to refine the machined shape accuracy by inserting the tool into the micro-hole. To overcome these issues, novel hybrid processes combined with micro-EDM were applied to effectively machine a micro-structure with high accuracy and quality surface.
    This study describes two hybrid processes that are micro-tool with ultrasonic vibration free abrasive grinding method and co-deposited micro-tool with grinding method. The circular and square micro-holes are investigated in this study. Experimental results show that the surface roughness of the micro-hole inner-wall can be well refined without micro-cracks and micro-craters by each of the proposed methods. For the circular micro-hole, using a helical micro-tool with ultrasonic vibration grinding method takes only 25 minutes to improve the machined surface from 1.35 to 0.58 µm Rmax, while using a co-deposited micro-tool grinding method can improve the machined surface roughness from 1.47 to 0.46 µm Rmax. By using a square micro-tool with ultrasonic vibration grinding method, the surface roughness of the square micro-hole inner-wall can be improved from 0.96 to 0.31 µm Rmax. Moreover, after EDM spherical forming, a micro-spherical tool is made by Ni-diamond co-deposition. A smooth surface of micro-spherical cavity can be gained using the micro-spherical diamond tool and better one has surface roughness 0.35 μm Rmax can be finished by combining with free abrasive grinding.

    摘 要 I Abstract II 謝 誌 IV 目 錄 V 圖 目 錄 IX 表 目 錄 XIII 第一章 緒論 1 1-1 研究動機與目的 1 1-2 研究背景 4 1-3 文獻回顧 6 1-3-1 微放電加工技術 6 1-3-2 微放電加工後表面精修技術 9 1-3-3 複合電鍍 10 1-4 研究方法 13 1-5 本文之構成 15 第二章 結合微放電與超音波振動研磨對微孔加工之研究 16 2-1 前言 16 2-2 基本原理 18 2-2-1 微放電加工 18 2-2-2 超音波振動 21 2-3 實驗設定 26 2-3-1 實驗設備 26 2-3-2 實驗材料 27 2-3-3 實驗方法 28 2-3-4 實驗流程 37 2-4 結果與討論 38 2-4-1微孔成型方式對改善圓形微孔形狀精度之探討 38 2-4-2 超音波振動研磨對改善圓形微孔精度之探討 41 2-4-2-1 圓形微孔入出口孔徑差改善率 41 2-4-2-2 圓形微孔孔壁表面粗度改善情況 47 2-4-3 微孔成型法對改善方形微孔形狀精度之探討 50 2-4-4 超音波振動研磨對改善方形微孔精度之探討 52 2-4-4-1 方形微孔入出口邊長差改善率 52 2-4-4-2 方形微孔孔壁表面粗度改善情況 54 2-5 結論 57 第三章 結合微放電與鎳-碳化矽複合電鍍法製作微圓柱型研磨工具對微孔精度改善之研究 58 3-1 前言 58 3-2 加工原理 59 3-2-1 複合電鍍原理 59 3-2-2 界面活性劑原理 61 3-3 實驗設定 62 3-3-1 實驗設備 62 3-3-2 實驗材料 63 3-3-3 實驗方法 65 3-3-4 實驗流程 68 3-4 結果與討論 69 3-4-1 複合電鍍沉積之鍍層特性 69 3-4-1-1 製程參數對鍍層厚度之影響 69 3-4-1-2 CTAB對鍍層特性之影響 71 3-4-2 鍍層表面磨粒附著 73 3-4-2-1 電流密度對鍍層表面磨粒附著之影響 73 3-4-2-2 陽極環孔徑對鍍層表面磨粒附著之影響 75 3-4-2-3 磨粒粒徑對鍍層表面磨粒附著之影響 77 3-4-2-4 工具轉速對鍍層表面磨粒附著影響 79 3-4-2-5 磨粒添加量對鍍層表面磨粒附著之影響 81 3-4-2-6 界面活性劑添加量對鍍層表面磨粒附著之影響 83 3-4-3 研磨加工後之工具磨耗與微孔表面特性 85 3-4-3-1 微型研磨工具之磨耗特性 85 3-4-3-2 磨粒粒徑對微孔研磨加工之影響 86 3-4-3-3 磨粒附著量對微孔研磨加工之影響 88 3-4-4 研磨加工前後孔壁表面之比較 89 3-5 結論 92 第四章 結合放電與鎳-鑽石複合電鍍法製作微型球狀研磨工具及其精微加工之研究 93 4-1 前言 93 4-2 表面張力原理 95 4-3 實驗設定 96 4-3-1 實驗設備 96 4-3-2 實驗材料 96 4-3-3 實驗方法 99 4-3-4 實驗流程 102 4-4 結果與討論 103 4-4-1 碳化鎢電極球狀放電成形 103 4-4-1-1電極材料 103 4-4-1-2 放電能量 105 4-4-1-3 電極轉速 107 4-4-2 複合電鍍參數對鍍層表面磨粒之影響 109 4-4-2-1 電流密度 109 4-4-2-2 工具轉速 112 4-4-2-3 磨粒添加量 115 4-4-2-4 加工時間 117 4-4-3 微型球狀工具加工微型球狀模穴測試 118 4-4-4 微型球狀工具搭配游離磨粒加工微型球狀模穴 122 4-5 結論 125 第五章 總結論 126 參考文獻 131 作者簡介 141

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