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研究生： 黃建融
Chien-Zong Huang
論文名稱： 電遷移對銅於液態銲錫中的溶解速率之影響
The dissolution rate of copper in the molten solder with current stressing
指導教授： 高振宏
C. Robert Kao
口試委員:
學位類別： 碩士
Master
系所名稱： 工學院 - 化學工程與材料工程學系
Department of Chemical & Materials Engineering
畢業學年度： 93
語文別： 中文
論文頁數： 95
中文關鍵詞： 電遷移 、液態銲錫 、溶解速率 、銅
外文關鍵詞： current stressing, dissolution ra, molten solder
相關次數： 點閱：13  下載：0 
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    • 在以往銲錫的電遷移研究中，探討對象都是固態銲錫，而液態銲錫是未被探討的。本實驗利用了微量毛細管設計了一個Cu/Sn/Cu結構，同時探討電遷移對液態、固態無鉛銲錫Sn-3.5Ag中Cu溶解現象的影響。我們利用維氏硬度計在Cu導線上打入marker以計算Cu導線溶解量，此marker與Cu導線頂端距離300 mm。在實驗中發現，試片於240 ℃下，施予電流密度6.3x103 A/cm2，會造成陰極端Cu導線相當嚴重的Cu溶解現象，通電時間達3 hr約有125 mm Cu導線溶解，並於陽極端生成大量IMC；相同的時間與電流密度，於185 ℃通電，陰極端Cu導線卻僅溶解1 mm；而在未通電的情況下，試片於255 ℃反應3 hr，Cu導線溶解約8.5 mm；相同的時間，試片於200 ℃，Cu導線溶解約1 mm；這表示電子流、熱效應對於Cu溶解現象有著交互的影響，本實驗對此現象作深入的探討，此現象有助於flip-chip銲點分析，進而對其毀壞機制的探討。這告訴我們，flip-chip銲點的毀壞，很有可能因電遷移造成銲點局部溶解，進而導致嚴重的Cu溶解現象，最後整個銲點失效。

    The electromigration of solder at solid state was studied in the past, but it was not discussed at liquid state. In this study, we take the micro capillary to design a Cu/solder/Cu structure. We make the marker on the copper wire with the distance of 300

    目錄 中文摘要................................................................I 英文摘要...............................................................II 目錄..................................................................III 圖目錄.................................................................VI 表目錄..................................................................X 第一章 序論............................................................1 1.1研究背景.............................................................1 1.2實驗目的及規劃.......................................................6 第二章 文獻回顧........................................................7 2.1電遷移理論...........................................................7 2.1.1電遷移之驅動力與通量方程式.........................................7 2.1.2 Blech結構之電遷移機制............................................10 2.1.3 back stress與臨界長度............................................12 2.1.4平均毀壞時間(MTTF)................................................14 2.2銲料中的電遷移現象..................................................15 2.2.1銲料中的電遷移機制................................................15 2.2.2電遷移對界面反應之影響............................................23 2.2.3覆晶銲點之電遷移現象..............................................25 2.2.4覆晶銲點毀壞機制－孔洞生長........................................30 2.2.5覆晶銲點毀壞機制－銅溶解現象......................................33 第三章 實驗方法與步驟.................................................37 3.1試片製作............................................................37 3.1.1將銲錫填入毛細管..................................................37 3.1.2銅導線之前處理....................................................37 3.1.3銅導線與銲錫之接合................................................38 3.2 實驗裝置與條件.....................................................42 3.2.1實驗裝置..........................................................42 3.2.2實驗條件..........................................................44 3.3 試片處理與儀器分析.................................................45 3.3.1試片金相處理......................................................45 3.3.2試片分析..........................................................45 第四章 實驗結果.......................................................47 4.1 Cu/Sn-3.5Ag(液態)/Cu...............................................47 4.1.1通電實驗（240 ℃、6.3×103 A/cm2）.................................47 4.1.2未通電實驗（255 ℃）..............................................54 4.1.3銅導線之消耗行為..................................................57 4.2 Cu/Sn-3.5Ag(固態)/Cu...............................................61 4.2.1通電實驗（185 ℃、6.3×103 A/cm2）.................................61 4.2.2未通電實驗（200 ℃）..............................................65 4.2.3介金屬之生長行為..................................................67 第五章 討論...........................................................70 5.1 Cu/Sn-3.5Ag(液態)/Cu之探討.........................................70 5.2 Cu/Sn-3.5Ag(固態)/Cu之探討.........................................73 5.3 Cu/Sn-3.5Ag(液態、液態)/Cu之比較...................................75 第六章 結論...........................................................77 6.1電遷移對IMC生長厚度之影響...........................................77 6.2 Cu溶解現象對真實flip-chip銲點之影響................................77 參考文獻...............................................................80

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