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研究生： 楊景棠
Ching-Tang Yang
論文名稱： 微電化學放電加工法應用於硼矽玻璃的精微加工及精度改善之研究
Improving Machining Precision of Pyrex Glass by Using Micro Electrochemical Discharge Machining
指導教授： 顏炳華
Biing-Hwa Yan
口試委員:
學位類別： 博士
Doctor
系所名稱： 工學院 - 機械工程學系
Department of Mechanical Engineering
畢業學年度： 95
語文別： 中文
論文頁數： 104
中文關鍵詞： 線切割 、電泳沉積研磨 、微孔加工 、玻璃加工 、電化學放電加工
外文關鍵詞： wire cut, electrophoretic deposition grinding, micro-hole, glass drilling, ECDM
相關次數： 點閱：25  下載：0 
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    • 電化學放電加工是加工非導電硬脆材料的新興技術，加工材料不受限於材料的硬度、導電度，但是由於其加工過程中涵蓋了電解反應、熱熔融與蝕刻反應，加工機制複雜使其未能有效控制加工品質，離產業的實用化仍有段差距；因此探討電化學放電加工的基本加工機制、開發及改善電化學放電加工在微孔與線切割上的品質是本論文所要探討的主題。
    本研究藉由攝影機觀察加工過程及加工電壓電流的波形，釐清加工中化學蝕刻與放電在材料移除機制上所扮演的角色，包括將硼矽玻璃置放於電解液中，並以CO2雷射加工玻璃表面，以模擬硼矽玻璃在如同電化學放電加工高溫高壓下的蝕刻狀況；另外使用傳統的放電加工，加工ITO導電玻璃(Indium Tin Oxide)，以暸解玻璃材料在純放電加工下的表面狀況，分別比較純化學蝕刻、純放電加工與電化學放電加工三種加工方法的加工表面狀況，進一步探討加工的材料移除機制；並開發直徑小於0.3mm的電化學放電微鑽孔技術，針對微孔的錐度，提出了使用Al2O3電泳沉積研磨的方法來改善微孔品質，由實驗結果顯示，微孔經階級式電極研磨500秒後，可將平均粗糙度降至5nm，錐度可以改善至0.2o；在線切割加工的應用上，如何減少切割痕(saw mark)與切槽寬度(kerf)是必須克服的議題，本研究在電解液中添加SiC磨粒，由於磨粒的研磨效果，在擴槽量、粗糙度及加工速度上相對於純電化學放電線切割加工都有較佳的表現，達到擴槽量為0.024mm，粗糙度為0.84μm Ra。

    Electrochemical discharge machining (ECDM) is new and developing technology to non-conductive hard brittle materials. The advantage of the technology is no limitation on brittleness and electrical conductivity. Since the complexity of ECDM involves the interdependency of thermal, electrochemical and mechanical effects, the machining quality can’t reach the application in industry. In view of such drawbacks, this study aims to investigate the machining mechanism in ECDM and enhance the precision quality of micro-holes and micro-slits machined by ECDM.
    Real time photographs and the current response were taken to observe the transition process in ECDM. The effects of chemical etching were studied by comparing three surface morphologies, high temperature chemical etching, electrical discharge machining (EDM) and ECDM. The machining mechanism can be further analyzed. Micro-holes of glass with diameter less then 0.3mm and thickness 1.5mm were developed. This study proposed using Al2O3 electrophoretic deposition grinding (EPDG) to further improve taper and surface roughness of the microholes. The surface roughness and taper angle can be improved to 5nm Ra and 0.2o after 500 sec grinding time, respectively. In the wire cut application, it is important to decrease the saw mark and kerf loss. This study proposed adding SiC abrasives in the electrolyte to improve the micro-slits quality. The expansion of micro-slit and surface roughness achieved were 0.024mm and 0.84μm Ra, respectively.

    中文摘要 I 英文摘要 II 謝誌 III 目錄 IV 圖目錄 VII 表目錄 XI 第一章 緒論 1 1-1 研究動機與目的 1 1-2 研究背景 4 1-3 文獻回顧 5 1-4 研究方法 7 1-5 本論文之構成 9 第二章 應用電化學放電加工法於硼矽玻璃微孔加工之研究 10 2-1 前言 10 2-2 實驗內容與方法 11 2-3 結果與討論 14 2-3-1微細電極製作 14 2-3-2電化學放電火花現象觀察 15 2-3-3電化學放電加工材料移除機制 19 2-3-3-1表面性狀觀察 19 2-3-3-2電解液對材料移除機制的影響 20 2-3-4加工參數對微孔加工品質的影響 24 2-3-4-1電解液濃度與初始溫度對加工時間的影響 24 2-3-4-2電解液濃度與種類對孔徑的影響 25 2-3-4-3電解液種類與輸入電壓對微孔表面粗度的影響 27 2-3-4-4荷重與加工時間的關係 28 2-3-4-5電極轉速與微孔真圓度的關係 29 2-3-4-6結合微放電與電化學放電加工於硼矽玻璃微孔加工 30 2-4 結論 32 第三章應用電泳沉積研磨改善電化學放電加工玻璃微孔品質 33 3-1 前言 33 3-2 電泳沉積原理 35 3-3 實驗內容與方法 37 3-3-1電泳沉積最佳參數 39 3-3-2實驗設備與加工參數 40 3-4 結果與討論 42 3-4-1電極直徑對研磨效果的比較 42 3-4-2研磨時間的影響 44 3-4-2-1研磨時間對孔徑差與擴孔量的影響 44 3-4-2-2研磨時間對真圓度的影響 45 3-4-2-3研磨時間對粗糙度的影響 47 3-4-3研磨轉速的影響 49 3-4-3-1研磨轉速對真圓度的影響 49 3-4-3-2研磨轉速對孔徑差與擴孔量的影響 50 3-4-3-3研磨轉速對粗糙度的影響 51 3-4-4研磨液粒徑的影響 52 3-4-4-1研磨液粒徑對真圓度的影響 53 3-4-4-2研磨液粒徑對孔徑差與擴孔量的影響 54 3-4-4-3研磨液粒徑對粗糙度的影響 56 3-5 結論 58 第四章電解液中添加SiC磨粒改善電化學放電切割特性的研究 60 4-1 前言 60 4-2 實驗內容與方法 60 4-2-1進給機構的改善 62 4-2-2實驗參數設定與實驗流程 64 4-3 結果與討論 66 4-3-1擴槽量 66 4-3-1-1磨粒濃度對擴槽量的影響 67 4-3-1-2粒徑對擴槽量的影響 69 4-3-1-3能量輸入頻率對擴槽量的影響 71 4-3-1-4衝擊係數對於擴槽量的影響 73 4-3-1-5電解液種類對於擴槽量的影響 74 4-3-1-6線張力對擴槽量的影響 75 4-3-1-7送線速度對於擴槽量的影響 76 4-3-2粗糙度 78 4-3-2-1磨粒添加濃度粒徑與對粗糙度的影響 78 4-3-2-2能量輸入頻率與衝擊係數對粗糙度的影響 83 4-3-3材料去除率 86 4-3-3-1能量輸入頻率與衝擊係數對加工速度的影響 87 4-3-3-2線張力與送線速度對加工速度的影響 89 4-3-3-3磨粒添加濃度與粒徑對加工速度的影響 91 4-3 結論 94 第五章 總結論 96 參考文獻 98

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