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研究生: 陳建佑
Jian-You Chen
論文名稱: 雷射掃描晶圓定位系統
Wafer Positioning by Laser Scanning Method
指導教授: 李朱育
Ju-Yi Lee
口試委員:
學位類別: 碩士
Master
系所名稱: 工學院 - 光機電工程研究所
Graduate Institute of Opto-mechatronics Engineering
畢業學年度: 100
語文別: 中文
論文頁數: 47
中文關鍵詞: 晶圓定位雷射掃描散射光時序訊號
外文關鍵詞: Scattering Light Signal, Wafer Positioning, Laser Scanning Method
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  • 本論文提出一雷射掃描晶圓定位系統用來量測集束型設備中晶圓的
    圓心位置。此定位系統是由雷射掃描系統與散射光偵測系統組成。利用振鏡
    掃描器將雷射光線反射至感測區域形成一道掃描光線。當機械手臂輸送晶圓
    通過掃描光線時,散射光偵測系統將接收到一光強度隨時間變化之散射光時
    序訊號。根據散射光時序訊號與已知的速度及位置參數,晶圓位置演算法便
    可計算出機械手臂運動速度與晶圓圓心位置。
    為驗證系統之定位能力,使用四吋晶圓進行實驗。在以實驗速度為速度
    參數之實驗中,定位精確度小於1.5mm;在以理論速度為速度參數之實驗中
    ,定位精確度則皆小於0.1mm。本系統亦可用於速度量測,速度量測之絕對
    誤差小於1mm/s,量測精確度則低於0.7mm/s。


    A laser scanning method for wafer positioning is proposeed to determine the center position of the wafer in the cluster tool. This positioning system incorporates a laser scanning system and a scattering light receiving system. The scanner is used to reflect a laser beam into a scanning line on the sensing area. As the wafer passes by the scanning line, a scattering light receiving system detects the time-sequence signal of the scattered lights. The velocity of a robot plate and the position of wafer ia determined by signal processing of the time-sequence signal.
    4-inch wafer positioning experiment results demonstrate that the positioning system can be used to detectc the positioning of a wafer. The velocity measurement precision is under 0.7 mm/s, and the absolut error is about 1 mm/s.
    The wafer positioning precision is 0.1 mm.

    中文摘要                i ABSTRACT               ii 目錄                  iii 表目錄                 v 圖目錄                 vi 符號說明                viii 第一章 緒論              1  1-1 研究背景            1  1-2 文獻回顧            2   1-2-1 晶圓定位技術        2   1-2-2 雷射掃描技術        6  1-3 研究目的與方法         7  1-4 論文架構            8 第二章 系統架構            9  2-1 元件與儀器介紹         9  2-2 雷射掃描晶圓定位系統      10   2-2-1 雷射掃描系統        11   2-2-2 散射光偵測系統       12  2-3 小結              14 第三章 晶圓位置演算法         15  3-1 定義定位系統座標系       15  3-2 時間與角度資訊擷取       16  3-3 機械手臂運動速度計算      17  3-4 晶圓邊緣位置計算        18  3-5 曲線擬合求晶圓圓心位置     19  3-6 小結              20 第四章 實驗結果與討論         21  4-1 實驗數據            21   4-1-1 參考角度量測        21   4-1-2 機械手臂運動速度量測    25   4-1-3 晶圓定位實驗        26  4-2 實驗討論            33   4-2-1 量測準確度         33   4-2-2 量測精確度         34   4-2-3 速度量測對晶圓定位之影響  36  4-3 小結              37 第五章 誤差分析            38  5-1 系統誤差            38   5-1-1 斜率誤差          39   5-1-2 高度誤差          39   5-1-3 參考角度誤差        40   5-1-4 速度誤差          41  5-2 隨機誤差            42  5-3 小結              43 第六章 結論與未來展望         44 參考資料                45

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