以壓縮感知鬼影成像系統還原矽橡膠封裝內的發光二極體熱影像

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研究生：	許詠翔 Yong-Siang Hsu
論文名稱：	以壓縮感知鬼影成像系統還原矽橡膠封裝內的發光二極體熱影像 Thermal Image Reconstruction of LED Encapsulated in Silicon Resin with a Compressive Ghost Imaging System
指導教授：	鍾德元
口試委員:
學位類別：	碩士 Master
系所名稱：	理學院 - 光電科學與工程學系 Department of Optics and Photonics
論文出版年：	2021
畢業學年度：	109
語文別：	中文
論文頁數：	104
中文關鍵詞：	壓縮感知、鬼影成像、熱影像、發光二極體
相關次數：	點閱：10 下載：0
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本篇論文闡述如何建構一套量測波長範圍在 2.5-5 μm 的中紅外壓縮感知鬼影成像系統
來量測在矽橡膠封裝內的 LED 晶片熱影像。藉由選擇適當的光學元件和單像素偵測器，
量測能穿透矽橡膠封裝的波長 3.7-4.7 μm 中紅外熱輻射，搭配空間光調制器(spatial light
modulator, SLM)提供空間解析度，最後再以基於壓縮感知的演算法，成功重建矽橡膠封
裝內 LED 晶片的熱影像

A ghost imaging system-based thermal camera is proposed and built to measure the thermal
image of a LED chip in silicone rubber encapsulation. With a proper choice of optics and a
bucket detector to measure the 3.5-4.5 μm thermal radiation transmitting the silicone
encapsulation, spatial resolution provided with spatial light modulation, and algorithm based
on compressive sensing, thermal images of a LED in the silicone rubber encapsulation can be
reconstructed.

中文摘要.....................................................................................................................................i
Abstract.......................................................................................................................................ii
致謝...........................................................................................................................................iii
目錄...........................................................................................................................................iv
圖目錄.....................................................................................................................................viii
表目錄.......................................................................................................................................xi
第一章 緒論..............................................................................................................................1
1-1 文獻回顧.........................................................................................................................1
1-2 研究動機.........................................................................................................................3
第二章 背景知識......................................................................................................................5
2-1 發光二極體(LED)的半導體材料 InGaN 光譜..............................................................5
2-2 發光二極體 LED 的熱特性 ...........................................................................................7
2-3 順向偏壓法.....................................................................................................................8
2-4 黑體輻射(blackbody radiation).....................................................................................10
2-5 矽橡膠封裝與吸收光譜...............................................................................................12
2-6 中紅外光光學元件.......................................................................................................13
2-7 紅外線偵測器與吸收光譜...........................................................................................15
2-8 鬼影成像(ghost imaging)...............................................................................................16
2-8-1 數位微形反射鏡元件............................................................................................16
2-8-2 鬼影成像系統 ........................................................................................................17
2-8-3 Standard ghost imaging ..........................................................................................18
2-9 壓縮感知(compressive sampling).................................................................................19
2-9-1 取樣的數學表示 ....................................................................................................19
2-9-2 稀疏性(sparsity)和有限等距性質(restricted isometry property)..........................20
2-9-3 1 minimization ........................................................................................................22
v
2-9-4 壓縮感知鬼影成像................................................................................................24
2-9 鎖相放大器與其原理...................................................................................................27
2-9-1 輸入訊號與乘法器................................................................................................27
2-9-2 低通濾波器 Lowpass filter ...................................................................................28
2-9-3 時間常數 Time constant ........................................................................................28
第三章 實驗儀器與設備........................................................................................................29
3-1 實驗樣品.......................................................................................................................29
3-1-1 電烙鐵 ....................................................................................................................29
3-1-2 石墨噴漆 ................................................................................................................29
3-1-3 金線.......................................................................................................................30
3-1-4 矽橡膠 ....................................................................................................................30
3-1-5 InGaN/GaN 藍光 LED...........................................................................................31
3-1-6 散熱膏 ....................................................................................................................31
3-2 光學元件.......................................................................................................................32
3-2-1 矽平凸透鏡 ............................................................................................................32
3-2-2 物鏡 ........................................................................................................................32
3-3 數位微形反射鏡元件(Digital Micromirror Device, DMD).........................................33
3-3-1 硬體 ........................................................................................................................33
3-3-2 DMD 晶片的吸收光譜...........................................................................................34
3-3-3 Pattern rate...............................................................................................................36
3-3-4 圖形使用者介面(graphical user interface, GUI)...................................................37
3-4 InAsSb 偵測器...............................................................................................................39
3-5 可見光偵測器...............................................................................................................40
3-5-1 DET100 ...................................................................................................................40
3-5-2 PDA36A2 ................................................................................................................40
3-6 雷射二極體控制台(Benchtop Laser Diode Controller) ..............................................40
3-7 鎖相放大器...................................................................................................................41
3-8 類比數位轉換器 analog to digital converter................................................................42
3-9 電磁加熱攪拌器...........................................................................................................42
3-10 研磨機.........................................................................................................................42
3-11 熱像儀.........................................................................................................................42
第四章 實驗架構....................................................................................................................43
4-1 光學架構 ......................................................................................................................43
4-2 電子電路架構 ..............................................................................................................45
4-3 4μmCGI 系統光學架構的數學描述.............................................................................47
4-4 程式架構.......................................................................................................................49
4-4-1 取樣矩陣和 sparsifying basis ................................................................................49
4-4-2 設定 DMD 播放參數.............................................................................................52
4-4-3 讀取電壓訊號 v .....................................................................................................53
4-4-4 影像還原 ................................................................................................................55
4-4-5 系統校正參數 ........................................................................................................55
第五章 實驗............................................................................................................................58
5-1 4μmCGI 系統的成像規格............................................................................................58
5-1-1 Field of View 識別..................................................................................................58
5-1-2 空間解析度量測 ....................................................................................................60
5-1-3 4μmCGI 系統景深量測..........................................................................................62
5-2 裸晶 LED 的熱影像還原 .............................................................................................63
5-3 矽橡膠封裝內 LED 晶片的熱影像還原 .....................................................................65
5-3-1 矽橡膠封裝製備 ....................................................................................................65
5-3-2 矽橡膠濾波片 ........................................................................................................66
5-3-3 順向偏壓法 ............................................................................................................69
5-3-4 封裝內 LED 的熱影像還原與 4μmCGI 系統驗證 ..............................................71
第六章 結論............................................................................................................................78
第七章 參考文獻....................................................................................................................79
第八章 附錄............................................................................................................................81
8-1 DMD 研磨與拋光..........................................................................................................81
8-2 Matlab 程式碼...............................................................................................................82
8-2-1 生成取樣矩陣和 DMD 播放影像.........................................................................82
8-2-2 matlab 讀取電壓值 v 和時脈訊號 Vclock程式碼...................................................84
8-2-3 影像還原 ................................................................................................................88
8-3 Labview 讀取電壓值方塊圖(block diagram)和前面板(front panel) ...........................91
                                

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