| 研究生: |
蔡禮仰 Li-Yang Tsai |
|---|---|
| 論文名稱: |
以ASM-HEMT Model建立氮化鋁鎵/氮化鎵高電子遷移率電晶體之模型 Modeling AlGaN/GaN HEMTs Using ASM-HEMT Model |
| 指導教授: | 綦振瀛 |
| 口試委員: | |
| 學位類別: |
碩士 Master |
| 系所名稱: |
資訊電機學院 - 電機工程學系 Department of Electrical Engineering |
| 論文出版年: | 2020 |
| 畢業學年度: | 108 |
| 語文別: | 中文 |
| 論文頁數: | 74 |
| 中文關鍵詞: | 氮化鎵 、建模 |
| 相關次數: | 點閱:8 下載:0 |
| 分享至: |
| 查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
基於現今移動通信的發展趨勢,高頻與高功率元件愈來愈受矚目,而氮化鎵高電子遷移率電晶體(GaN-based High Electron Mobility Transistor, HEMT)有較高的崩潰電壓與在高功率操作下保有良好的元件特性,成為了高功率元件的重要材料。我們將此氮化鎵元件特性利用ASM-HEMT Model(Advanced Spice Model)進行建模,將元件的物理特性曲線轉換為電腦可讀取模擬的型式,以供後續IC設計者做電路模擬設計使用。
本研究係以ASM-HEMT Model進行氮化鎵元件建模,內容分為直流與小訊號兩部份。ASM-HEMT Model是以半導體物理為基礎的模型,利用表面電荷(surface potential)的計算來模擬出實際元件的特性,故在參數萃取上須同時考慮直流與小訊號兩個部份。文中詳述直流參數的萃取過程,並加入陷補效應(trapping effect)與自發熱效應(self-heating effect)等等非理想因素來使模擬曲線更加吻合元件實際的量測曲線。
本論文亦探討直流特性擬合完成後,小訊號模擬結果卻不準確之情況下,如何改善擬合的步驟與過程,並說明在參數調整時直流與小訊號曲線之間的取捨。
GaN-based high electron mobility transistors (HEMTs) have received increasing attention for 5G mobile communications because of their great potential in millimeter wave high efficiency power amplifiers. In this work, the ASM-HEMT model (Advanced Spice Model) was used to model the device characteristics of an GaN HEMT. The procedures to fit the measured results as well as the effects of fitting parameters on the simulated results are described and discussed in this thesis.
The content of this thesis is divided into two parts, i.e. DC and small signals. The ASM-HEMT model is a physical model constructed based on semiconductor device physics. It uses the surface potential to simulate the characteristics of the device. Therefore, both DC and small signal characteristics must be considered in the parameter extraction processes. In this study, the extraction process of the DC parameters is detailed, and non-ideal effects such as trapping effect and self-heating effect are added to make the simulated results more consistent with the measured results.
This thesis also discusses the iteration fitting procedure to deal with the situation where the small signal simulated results are inconsistent with the measured ones after the DC characteristic fitting process is completed. Detailed illustration of the effect of each parameter and the trade-off between the DC and small signal fitting parameters are also described.
[1] O. Ambacher, J. Smart, J. Shealy, N. Weimann, K. Chu, M. Murphy, W. Schaff, L. Eastman, R. Dimitrov, and L. Wittmer, "Two-dimensional electron gases induced by spontaneous and piezoelectric polarization charges in N-and Ga-face AlGaN/GaN heterostructures, " Journal of Applied Physics, vol. 85, no. 6, pp. 3222-3233, 1999.
[2] Fabio Sacconi, Aldo Di Carlo, P. Lugli, and Hadis Morkoç, "Spontaneous and Piezoelectric Polarization Effects on the Output Characteristics of AlGaN/GaN Heterojunction Modulation Doped FETs, " IEEE Transactions on electron devices, vol. 48, pp. 450-457, 2001
[3] Jason Chen, "RF GaN Model Survey and Model Parameter Extraction Flows, " Keysight EEsof EDA, 2019.
[4] V. Zomorrodian, Y. Pei, U. K. Mishra, and R. A. York, "A scalable EE HEMT based large signal model for multi-finger AlGaN/GaN HEMTs for linear and non-linear circuit design," physical status solidi (c), vol. 7, no. 10, pp. 2450-2454, 2010.
[5] C. William, "Small and large signal modeling of mm-wave HEMT devices. " PhD thesis, University of South Florida, 2003.
[6] I. Angelov, H. Zirath, and N. Rosman, "A new empirical nonlinear model for HEMT and MESFET devices," Microwave Theory and Techniques, IEEE Transactions on, vol. 40, no. 12, pp. 2258-2266, 1992.
[7] L. Dunleavy, C. Baylis, W. Curtice, and R. Connick, " Modeling GaN: Powerful but challenging," Microwave Magazine, IEEE, vol. 11, no. 6, pp. 82-96, 2010.
[8] Q. Chen, "Latest advances in gallium nitride HEMT modeling," 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Guilin, pp. 1-4, 2014.
[9] J. Xu, R. Jones, S. A. Harris, T. Nielsen and D. E. Root, "Dynamic FET model - DynaFET – for GaN transistors from NVNA active source injection measurements," 2014 IEEE MTT-S International Microwave Symposium (IMS2014), Tampa, FL, pp. 1-3, 2014.
[10] S. Khandelwal, Y. S. Chauhan and T. A. Fjeldly, "Analytical Modeling of Surface-Potential and Intrinsic Charges in AlGaN/GaN HEMT Devices," IEEE Transactions on Electron Devices, vol.59, no.10, pp. 2856-2860, Oct. 2012.
[11] S. Khandelwal et al., "Robust Surface-Potential-Based Compact Model for GaN HEMT IC Design," in IEEE Transactions on Electron Devices, vol. 60, no. 10, pp. 3216-3222, Oct. 2013.
[12] A. Dasgupta, S. Ghosh, Y. S. Chauhan and S. Khandelwal, "ASM-HEMT: Compact model for GaN HEMTs," 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC), Singapore, pp. 495-498, 2015.
[13] Sourabh Khandelwal, Yogesh Singh Chauhan, Tor A. Fjeldly, Sudip Ghosh, Ahtisham Pampori, Dhawal Mahajan, Raghvendra Dangi, Sheikh Aamir Ahsan, "ASM GaN: Industry Standard Model for GaN RF and Power Devices- Part 1: DC, CV, and RF Model, " IEEE Transactions on Electron Devices, vol. 66, no. 1, pp.81, 2019.
[14] A. Dasgupta, S. Ghosh, Y. S. Chauhan and S. Khandelwal, "ASM-HEMT: Compact model for GaN HEMTs," 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC), Singapore, pp. 495-498, 2015.
[15] S. Khandelwal, Y. S. Chauhan and T. A. Fjeldly, "Analytical Modeling of Surface-Potential and Intrinsic Charges in AlgAN/GaN HEMT Devices," IEEE Transactions on Electron Devices, vol. 59, no. 10, pp. 2856-2860, 2012.
[16] G. Meneghesso, F. Rampazzo, P. Kordos, G. Verzellesi, and E. Zanoni, " Current collapse and high-electric-field reliability of unpassivated GaN/AlGaN/GaN HEMTs," Electron Devices, IEEE Transactions on, vol. 53, no. 12, pp. 2932-2941, 2006.
[17] H. Hasegawa, T. Inagaki, S. Ootomo, and T. Hashizume, "Mechanisms of current collapse and gate leakage currents in AlGaN/GaN heterostructure field effect transistors," Journal of Vacuum Science Vamp; Technology B: Microelectronics and Nanometer Structures, vol. 21, no. 4, pp. 1844-1855, 2003.
[18] R. Vetury, N. Q. Zhang, S. Keller, and U. K. Mishra, " The impact of surface states on the DC and RF characteristics of AlGaN/GaN HFETs," Electron Devices, IEEE Transactions on, vol. 48, no. 3, pp. 560-566, 2001.
[19] G. Simin, A. Koudymov, A. Tarakji, X. Hu, J. Yang, M. A. Khan, M. Shur, and R. Gaska, "Induced strain mechanism of current collapse in AlGaN/GaN heterostructure field-effect transistors," Applied Physics Letters, vol. 79, no. 16, pp. 2651-2653, 2001.
[20] S. C. Binari, K. Ikossi, J. A. Roussos, W. Kruppa, D. Park, H. B. Dietrich, D. D. Koleske, A. E. Wickenden, and R. L. Henry, " Trapping effects and microwave power performance in AlGaN/GaN HEMTs," Electron Devices, IEEE Transactions on, vol. 48, no. 3, pp. 465-471, 2001
[21] M. Liang and M. E. Law, "Influence of lattice self-heating and hot-carrier transport on device performance," IEEE Trans. Electron Devices, vol. 41, pp. 2391-2398, Dec. 1994.
[22] S. Khandelwal, Nitin Goyal, and Tor A. Fjeldly, "Device geometry scalable thermal resistance model for GaN HEMT devices on Sapphire substrate," in Reliability of Compound Semiconductor Workshop. Palm Springs, USA, April 2011.
[23] M. Kuball, S. Rajasingam, and A. Sarua, "Measurement of temperature distribution in multifinger AlGaN/GaN heterostructure field-effect transistors using micro-Raman spectroscopy, " Applied Physics Letters, vol. 82, no. 1, pp. 6, 2003.