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研究生: 彭偉杰
Wei-Jie Peng
論文名稱: 先進電離層探測儀整合測試系統
Integrated Test System of Advanced Ionospheric Probe
指導教授: 趙吉光
Chi-Kuang Chao
口試委員:
學位類別: 碩士
Master
系所名稱: 地球科學學院 - 太空科學研究所
Graduate Institute of Space Science
論文出版年: 2014
畢業學年度: 102
語文別: 中文
論文頁數: 191
中文關鍵詞: 先進電離層探測儀
外文關鍵詞: Advanced Ionospheric Probe
相關次數: 點閱:12下載:0
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  • 福衛五號先進電離層探測儀(Advanced Ionosperic Probe, AIP)需要一套整合測試系統,驗證其中電漿探測器的量測特性,找出誤差範圍與校正曲線。此系統使用的硬體為NI-cRIO 9074搭配自製的三種C型模組,分別為收發模組(Transceiver Module)、SPI模組(皆為單端與差分訊號轉換),電源模組(電源監控與配置)。使用的軟體為LabVIEW FPGA Module與LabVIEW Real-Time Module。透過LabVIEW FPGA Module,撰寫類比轉數位元件(ADC-LTC1867)、數位轉類比元件(DAC-DAC121S101QCMK)、溫度感測器(TMP-TMP122AMDBVTEP)的SPI數位波形與其他數位IO的控制。透過LabVIEW Real-Time Module,撰寫指令收發與科學資料處理之功能。利用此測試系統,本論文已量測出探測器的掃描電壓校正曲線、電流注入校正曲線等重要特性,未來福衛五號進行科學量測時,將可依此正確地解釋量測的電離層參數。


    Since the production of flight model of Advanced Ionospheric Probe (AIP) of FORMOSAT-5 (FS-5) has been completed. A test system is required to measure the characteristics of the sensor. The integrated test system is an overall solution for the controll, test and calibration for AIP. The main purpose is to measure the characteristics of sensor, finding the error range and the calibration curve. The hardware contains a controller of NI-cRIO 9074 and three self-made C series modules: transceiver module, SPI module and power module. Transceiver module and SPI module convert the single-ended signal to differential signal or in reverse. Power module distributes power to all devices and continuesly monitoring the current comsuption. The software is built with the embedded framework combined with LabVIEW FPGA module and LabVIEW Real-Time OS, which is based on the LabVIEW programming language. The LabVIEW FPGA module is used to achieve the SPI interfacing for ADC of LTC1867, DAC of DAC121S101, TMP of TMP122 and also some low-level IO control. The LabVIEW Real-Time OS is used to build the top-level UI consisted of command transmitter, science data viewer, and the preview on the result of data characteristics in real-time. This system is able to perform the current injection test to get the profile of calibration curves of AIP sensor, and also with the complete function of SPEU to perform the plasma injection test inside plasma chamber. With the integrated test system, a series of comprehensive test are done to get the parameters and characterestics curves of sensor, to ensure the accuracy and quality of geophysical data from AIP onboarded FS-5.

    目錄 圖目錄 ....... vi 表目錄 ..... xiii 1. 簡介 ....... 1 1.1. 先進電離層探測器 ....... 1 1.1.1. 探測器機構簡介 .... 3 1.1.2. 探測器電路簡介 .... 4 1.1.3. 探測器44 Pin D-Sub接頭腳位定義 .. 6 1.2. 整合測試系統 ..... 7 2. 整合測試系統 . 8 2.1. 硬體架構 .. 8 2.1.1. NI-cRIO 9076簡介 . 8 2.1.2. 15 Pin D-Sub接頭腳位定義 .... 10 2.1.3. 自製模組 .... 12 2.2. 軟體架構 18 2.2.1. LabVIEW FPGA/Real-Time Module簡介 .. 18 2.2.2. 程式架構 .... 19 2.3. SPI . 41 2.3.1. SPI簡介 ...... 41 2.3.2. DAC-DAC121S101QCMK ...... 43 2.3.3. ADC-LTC1867...... 45 2.3.4. TMP-TMP122AMDBVTEP ..... 47 2.3.5. SPI取樣時序圖 .... 48 2.4. 次模式簡介 ....... 50 2.4.1. SPI0/1 ......... 51 2.4.2. SENSON/OFF ....... 51 2.4.3. TESTON/OFF ....... 51 2.4.4. SAFE/NORMAL/FAST/BURST模式 ......... 52 2.4.5. PRI/PLP/RPA/IDM ......... 52 2.4.6. VODA0/1 .... 54 2.4.7. OCDON/OFF ........ 54 2.4.8. DOAD0/1 .... 54 2.4.9. FPDON/OFF ......... 54 2.4.10. PSVBLK0/1/2/3 .. 55 2.4.11. RSVBLK0/1/2/3 .. 55 2.4.12. TRIGON/OFF ..... 55 2.4.13. IDM0/1/2/3/SV Enable/Disable ........ 55 2.4.14. CHADLF0/1/2/3 Enable/Disable ...... 56 2.4.15. CKSVSTEP Enable/Disable ... 57 2.4.16. 0VODA Enable/Disable 57 2.5. RS-232傳輸介面 ......... 57 2.5.1. RS-232(19.2kbps) . 57 2.5.2. RS-232 Prot . 58 2.6. 技術困難 59 2.6.1. SPI數位訊號延遲問題(Delay) 59 2.6.2. 突波問題(Glitch) . 62 2.6.3. 主要與備援SPI訊號互相干擾 ........ 67 3. 探測器模擬器 ......... 68 3.1. 硬體架構 68 3.1.1. NI-cRIO 9074簡介 ......... 68 3.1.2. 15 Pin D-Sub接頭腳位定義 .... 69 3.2. 軟體架構 69 3.2.1. LabVIEW FPGA/Real-Time Module簡介 .. 69 3.2.2. 程式架構 .... 70 3.3. ITS數位波形狀態機之驗證 . 76 3.3.1. SPI數位波形的驗證 ...... 76 3.3.2. 掃描電壓的驗證 .. 80 3.3.3. 科學資料封包的驗證 .... 87 3.3.4. 溫度資料的驗證 .. 94 3.3.5. 總結 . 95 4. 測試結果與討論 ...... 96 4.1. ITS功能初測 ..... 96 4.1.1. DAC功能初測 ..... 96 4.1.2. ADC功能初測 ... 101 4.2. 校正 ...... 106 4.2.1. DAC校正測試 ... 106 4.2.2. ADC校正測試 ... 113 5. 結論 ... 129 參考文獻 130 附錄A-開始NI-FPGA專案 132 附錄B-CDMU模擬器 ......... 143 附錄C-科學資料封包檢查程式 .... 157 附錄D-探測器電路板之腳位定義 165 附錄E-模組電路簡介 168

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