| 研究生: |
劉大銘 Ta-Ming Liu |
|---|---|
| 論文名稱: |
LED封裝材料開發與其可靠度追蹤 Development of LED Packaging Materials and Its Reliability Tracking |
| 指導教授: |
陳銘洲
Ming-Chou Chen |
| 口試委員: | |
| 學位類別: |
博士 Doctor |
| 系所名稱: |
理學院 - 化學學系 Department of Chemistry |
| 論文出版年: | 2017 |
| 畢業學年度: | 105 |
| 語文別: | 中文 |
| 論文頁數: | 90 |
| 中文關鍵詞: | 發光二極體 |
| 外文關鍵詞: | LED |
| 相關次數: | 點閱:9 下載:0 |
| 分享至: |
| 查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
本篇論文重點在於合成出一種矽膠改質環氧樹脂的高黏度封裝材,不
僅可防止白光LED 的螢光粉沈降,並且藉由相溶性高的Siloxane 混摻,
降低封裝材的內應力,同時配合永光化學的安定劑配方,製造出高透明性
的LED 封裝材料,而且此複合材料的特性也綜合了Epoxy 與Silicon 的優點-價格便宜、高折射、與支架附著性高、耐熱、耐紫外線與高阻水阻氣
性,可應用於所有的照明市場。
Highly transparent encapsulants based on Epoxy and Silicone hybrid for LED were developed. With siloxane contained within, the modified polymers not only mix uniformly with silicone resin to prevent phosphor from settling, but also exhibit lower internal stress; therefore the probability of a LED failure was reduced. Furthermore, with addition of stabilizer, the resin demonstrate good resistance to heat and UV light. With high refractive index, high adhesion, good heat and UV resistance, and low water vapor transmission rate, this low cost new polymers can be practically applied in the lighting market of LED.
﹝1﹞TSUNG-YI CHAO, TW Patent No. 201,107,404 ,2009
﹝2﹞NAKANISHI, MASATAKA, TW Patent No. 201,120,000 ,2010
﹝3﹞Tomohiro Sugawara, US Patent No. 2008/ 0,039,591,2006
﹝4﹞Parker Earl E, US Patent No. 3,374,208 ,1968
﹝5﹞Chich-Haw Lin, US Patent No. 2012/0,172,505 ,2010
﹝6﹞Sato Atsushi, CN Patent No. 102,869,697 ,2010
﹝7﹞Heinz Schuh, US Patent No. 4,265,966 ,1978
﹝8﹞Jerome A. Seiner, Journal of Applied Polymer Science, Vol. 97, 946-
951,2005
﹝9﹞Albert J Dalhuisen, US Patent No. 3,505,283 ,1967
﹝10﹞Sheng-Shu Hou, Polymer 41 3263–3272,2000
﹝11﹞Andreas Lutz, CN Patent No. 101,040,025,2004
﹝12﹞Hatsuo Ishida, Douglas j. Allen, Journal of Polymer Science: Part B
76
Polymer Physics, Vol. 34,1019-1030 (1996)
﹝13﹞Thomas Bert Gorczyca, TW Patent No. 304,415,2008
﹝14﹞细川和人, CN Patent No. 1,591,809,2003
﹝15﹞徐博剛, CN Patent No. 102,020,572,2009
﹝16﹞John H. Schmidt, US Patent No. 1,663,183,1924
﹝17﹞Klaus Hohn, Tauikirchen,Alexandra Debray, Regensburg,Peter
Schlotter, Freiburg ,Ralf Schmidt, Vorstetten ,J iirgen Schneider,
Kirchzarten , US Patent No. 101,040,025,1996
﹝18﹞Ulrike Reeh, Hans Denk, US Patent No. 4,365,052,1980
﹝19﹞Sheng-Shu Hou, Yen-Pin Chung, Cheng-Kuang Chan, Ping-Lin
Kuo, Polymer 41 3263–3272,2000
﹝20﹞Albert J. Dalhuisen, US Patent No. 3,505,283,1970
﹝21﹞Yasumasa Morita, Journal of Applied Polymer Science, Vol. 97, 946–
951,2005
77
﹝22﹞Heinz Schuh, US Patent No. 4,265,966,1978
﹝23﹞佐藤笃志, CN Patent No. 102,869,697,2010
﹝24﹞Chich-HaW Lin, Shu-Chen Huang,Hsun_Tien Li, US Patent No.
8,440,774,2010
﹝25﹞Jerome A. Seiner, Earl E. Parker, US Patent No. 3,374,208,1968
﹝26﹞Takao Iijima, Ken-Ichiro Fujimoto, Masao Tomoi, Journal of
Applied Polymer Science, Vol. 84, 388–399,2002
﹝27﹞Tomohiro Sugawara,Takeshi Koyama,Atsushi Okoshi,Takashi
Sato,Shuichi Ueno, US Patent No. 8,034,962,2008