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研究生： 賴彥璋
Yen-chang Lai
論文名稱： 印刷電路板組裝之表面黏著機之電子元件取置作業規劃
Operation planning of Collect and place machines in PCB assembly
指導教授： 何應欽
Ying-chin Ho
口試委員:
學位類別： 碩士
Master
系所名稱： 管理學院 - 工業管理研究所
Graduate Institute of Industrial Management
畢業學年度： 95
語文別： 中文
論文頁數： 101
中文關鍵詞： 表面黏著技術 、印刷電路板 、表面黏著機
外文關鍵詞： Surface Mount Technology, Surface Mount Device placement machine, Printed Circuit Board
相關次數： 點閱：5  下載：0 
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    • 表面黏著技術(Surface Mount Technology；SMT)是屬於印刷電路板組裝(Printed Circuit Board Assembly；PCBA)製造流程中封裝作業的核心技術，而表面黏著機(Surface Mount Device)能夠把體積較小且重量較輕的電子元件精準的放置在印刷電路板的位置上，在整個表面黏著製程中就屬表面黏著機的取置作業所耗費的時間最，該機械會受到元件供料的位置、取置機抓取元件順序與放置元件順序的安排不當，而影響電路板組裝時間。
    我們希望藉由有效率的規劃表面黏著機(取置機)的電子元件取置作業，使取置機的平均完成時間越小越好。吾人將表面黏著機的規劃方式分成兩個子問題，第一個問題是要決定用來裝載元件供料器，而求解此問題時得先決定要用何種標準去安排供料器的位置，吾人是以元件彼此之間距離上的相關性做評判之後再決訂供料器的指派，而第二個子問題是要決定取置頭的元件取置作業順序，由於這兩個子問題之間有著高度依賴性，因此吾人在決定供料器的位置時也會同時顧及到取置頭潛在可能的取置作業順序，而本研究希望針對各子問題發展有效的演算法，在各種不同的PCB 類型下找出最有效率的演算法，吾人期望以達到整個印刷電路板平均組裝週期時間最小化的目的。

    The Surface mount technology is the core of the PCB assembly. The surface mount device placement machine can put the component on the PCB speedy and precise. In the whole PCB assembly process, the operation of the placement machine is the bottleneck. A good scheduling the operations of Collect-and-place machine can cut down the PCB assembly cycle time effectively. We propose a series of heuristics to solve the feeder assignment problem. Based on the location of the feeder in the magazine, the component placement sequence is determined. When both of the problems are determined, we propose a simulated annealing heuristic to improve the order of the placement tours. Finally, we compare the performance of the heuristics to the lower bound value which is introduced by Grunow et al.(2004).Numerical experiments show that our heuristic can reduce the PCB assembly cycle time conspicuously, and the simulated annealing heuristic can also improve the PCB cycle time.The series of the heuristics compare slightly deviation with the lower bound value.

    摘要 i 目錄 ii 圖目錄 iv 表目錄 vi 第一章 緒論 1 1.1 研究背景與動機 1 1.2 研究目的 2 1.3 研究環境與假設 3 1.4 論文架構 6 第二章 文獻探討 8 2.1 表面黏著技術的基本介紹 8 2.2 取置機(Placement machine)介紹 8 2.2.1 取置機基本作業模式與構造 9 2.2.2 取置機分類 11 2.3取置機作業規劃相關文獻 18 2.3.1雙邊同時作業放置機 18 2.3.2 多站放置機 19 2.3.3 轉塔式放置機 20 2.3.4 多吸嘴取置頭放置機 22 2.3.4.1 吸嘴平行排列取置型 22 2.3.4.2 吸嘴環繞旋轉頭取置型 24 2.3.5 順序作業型取置機 25 2.4 模擬退火法 26 2.4.1『模擬退火』簡介 27 2.4.2模擬退火的應用 28 第三章 研究方法 30 3.1 問題分析 30 3.2 元件供料器指派法 31 3.2.1 決定元件間的相關度的權重分數 31 3.2.1.1直線遞增法： 32 3.2.1.2指數遞減-方法1： 33 3.2.1.3 指數遞減-方法2： 36 3.2.2 決定供料器排列位置 37 3.2.2.1 Method.5 37 3.2.2.2 貪婪演算法(Greedy algorithm) 39 3.2.2.3 最小移動時間懲罰值法 41 3.3 元件取置順序法 45 3.3.1 最小移動時間損失概念 45 3.3.1.1 最小移動時間損失-方法1： 45 3.3.1.2 最小移動時間損失-方法2： 51 3.3.2 節省路徑法 53 3.4 模擬退火法的應用與目標函數 54 第四章 實驗分析與設計 56 4.1 實驗環境與假設 56 4.2 實驗分析方法 58 4.3 統計分析與實驗結果 58 4.3.1 ANOVA之前提假設分析 58 4.3.2 PCB平均完成時間之統計分析 61 4.3.3 使用模擬退火法後績效的改善 87 4.4 本章小節 90 第五章 結論與建議 93 5.1研究結論 93 5.2後續研究與建議 95 參考文獻 96

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