| 研究生: |
謝東伯 Dong-Bo Xie |
|---|---|
| 論文名稱: |
噴流或吸流對共軛熱傳的影響 |
| 指導教授: |
林孝宗
Shaw-Chong Lin |
| 口試委員: | |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 化學工程與材料工程學系 Department of Chemical & Materials Engineering |
| 畢業學年度: | 89 |
| 語文別: | 中文 |
| 論文頁數: | 79 |
| 中文關鍵詞: | 噴流或吸流 、共軛熱傳 |
| 外文關鍵詞: | blowing or suction, conjugate |
| 相關次數: | 點閱:11 下載:0 |
| 分享至: |
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本文所探討的系統為流體流過一塊表面具有多孔隙之平板,其板面可噴出或吸入相同的流體。並且同時考慮固體壁中的熱傳導及流體的熱對流對系統的影響,兩者合併求解。這種必須同時考慮固體內熱傳導與流體熱對流的複合系統,稱為共軛(conjugate)熱傳系統。
本文對以下兩個熱傳系統,進行理論解析與數值模擬:
一、噴流或吸流(blowing and suction)對平板系統的傳導與強制對流之共軛熱傳的影響。
二、噴流或吸流對垂直板中的傳導與自然對流之共軛熱傳的影響。
無噴流或吸流,以及平板外壁表面維持等溫或等熱通量的加熱方式,都是本文所涵蓋的特例。
所得數值結果顯示:噴流效應使邊界層厚度增加,因而使等溫板系統之熱傳速率減少,或使等熱通量板之板面溫度增高;吸流之效應則恰巧相反。
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