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研究生： 洪嘉宏
Jia-hong Hong
論文名稱： 無鉛銲料與添加鈀層之無電鍍鈷基材界面反應研究
Massive spalling and morphological change of intermetallic compound affected by adding Pd in Co-based surface finishes
指導教授： 吳子嘉
Albert T. Wu
口試委員:
學位類別： 碩士
Master
系所名稱： 工學院 - 化學工程與材料工程學系
Department of Chemical & Materials Engineering
論文出版年： 2013
畢業學年度： 101
語文別： 中文
論文頁數： 72
中文關鍵詞： 無鉛銲料 、界面反應 、無電鍍鈷 、無電鍍鈀 、大規模剝離 、界面能
外文關鍵詞： Pb-free solder, interfacial reaction, electroless cobalt, electroless palladium, massive spalling, interfacial energy
相關次數： 點閱：12  下載：0 
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    • 本研究主要討論Sn-3.0Ag-0.5Cu銲料分別與四種無電鍍鈷系統之界面反應，並探究其表面形貌之改變與相變化。此無電鍍鈷系統包含無電鍍鈷(Electroless Cobalt，EC)、無電鍍鈷/浸金(Electroless Cobalt/Immersion Gold，ECIG)、無電鍍鈷/無電鍍鈀(Electroless Cobalt/Electroless Palladium，ECEP)及無電鍍鈷/無電鍍鈀/浸金(Electroless Cobalt/Electroless Palladium/Immersion Gold，ECEPIG)等，其中無電鍍鈷層內含有磷及微量的鎢元素，即Co(W,P)。
    實驗結果顯示，系統添加鈀層之後，不僅改變介金屬化合物之表面形貌，更引致(Co,Cu,Pd)Sn3發生大規模剝離。在Co(W,P)消耗完之後的迴銲過程，高的界面能及厚的介金屬化合物，造成(Co,Cu,Pd)Sn3內部產生壓應力。因此，藉由彎曲釋放內部壓應力，可能為引致(Co,Cu,Pd)Sn3發生大規模剝離之驅動力。

    This study investigates the interfacial reactions and microstructures of SAC305 solders on four different Co-based surface finishes, electroless Co(W,P) (EC), electroless Co(W,P)/immersion Au (ECIG), electroless Co(W,P)/electroless Pd (ECEP), and electroless Co(W,P)/electroless Pd/immersion Au (ECEPIG). The evolution of microstructure at different reflow conditions revealed that Pd layer not only changed the morphology of the intermetallic compound but also generated higher interfacial energy between solders and Co-based substrates. High interfacial energy and thick reaction phase could induce compressive stress within the (Co,Cu,Pd)Sn3 layer during the reflow process after exhausting Co(W,P). The reduction of the stress could be the possible driving force for massive spalling of the (Co,Cu,Pd)Sn3 intermetallic compound.

    中文摘要....................................................I Abstract..................................................II 致謝.....................................................III 目錄......................................................IV 圖目錄.....................................................VI 表目錄...................................................VIII 第一章 序論.................................................1 1-1 前言...................................................1 1-2 構裝層級................................................2 1-3 構裝技術................................................3 1-3-1 打線接合(Wire bonding)................................4 1-3-2 捲帶式接合(Tape automated bonding)....................4 1-3-3 球閘陣列構裝(Ball Grid Array，BGA).....................4 1-3-4 覆晶接合(Flip chip)...................................6 1-4 界面反應................................................7 1-5 銲料與Co界面反應之文獻回顧.................................7 1-5-1 Sn/Co界面反應.........................................8 1-5-2 銲料/Co-P界面反應.....................................12 1-5-3 銲料/Co(W,P)界面反應..................................14 1-6 介金屬化合物之硬度.......................................17 1-7 添加Pd對界面的影響.......................................18 1-7-1 界面反應.............................................18 1-7-2 接點機械性質..........................................21 1-8 剝離現象之文獻回顧.......................................23 1-8-1 潤濕層(Wetting layer)消耗完...........................23 1-8-2 系統有限的反應元素(Limited reactive constituents)......24 1-8-3 界面能的改變..........................................27 1-9 研究目的...............................................29 第二章 實驗方法.............................................31 2-1 EC、ECIG、ECEP及ECEPIG基材製備..........................31 2-2 無鉛銲料製備............................................32 2-3 液/固界面反應...........................................32 2-4 金相處理與試片分析.......................................32 2-4-1 掃描式電子顯微鏡(SEM)..................................32 2-4-2 電子微探儀(FE-EPMA)..................................33 第三章 結果與討論............................................35 3-1 無鉛銲料與EC、ECIG、ECEP及ECEPIG基材之界面反應.............35 3-1-1 SAC/EC液/固界面反應...................................35 3-1-2 SAC/ECIG液/固界面反應.................................41 3-1-3 SAC/ECEP液/固界面反應.................................43 3-1-4 SAC/ECEPIG液/固界面反應...............................45 3-2 討論..................................................47 3-2-1 (Co,Cu,Pd)Sn3、Co-Sn-P及(Cu,Co,Pd)6Sn5之生成.........47 3-2-2 (Co,Cu)Sn3與(Co,Cu,Pd)Sn3之表面形貌...................49 3-2-3 (Co,Cu,Pd)Sn3發生大規模剝離之現象......................50 第四章 結論................................................54 參考文獻...................................................56

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