| 研究生: |
黃柏文 Bo-Wen Huang |
|---|---|
| 論文名稱: |
模擬遮罩式陣列槽微電化學加工的二維電場耦合熱流場 The Numerical Simulation of Groove Arrays by Through-Mask Electrochemical Drilling Considering Electric and Thermal-Fluid Effects. |
| 指導教授: |
洪勵吾
Lih-Wu Hourng |
| 口試委員: | |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 能源工程研究所 Graduate Institute of Energy Engineering |
| 論文出版年: | 2019 |
| 畢業學年度: | 107 |
| 語文別: | 中文 |
| 論文頁數: | 217 |
| 中文關鍵詞: | 陣列槽 、遮罩式電化學微加工 、輸入電壓 、輸入流速 、非均勻性 |
| 外文關鍵詞: | groove arrays, through-mask electrochemical micromachining, voltage, flow rate, non-uniformity |
| 相關次數: | 點閱:14 下載:0 |
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鑑於遮罩式電化學微加工的研究,在實驗方面無法詳述結果的成因,而模擬方面大多僅考慮單一個物理場和加工目標,而考慮多物理場者,又嚴重低估焦耳熱的影響。所以本次研究以陣列槽為觀測對象,並對焦耳熱進行修正,從而模擬TMEMM之二維的電場耦合熱流場以詳細分析加工的結果。
由模擬結果得知,若輸入電壓較高,則加工速度較快、過切較差,而蝕刻因子變化不大。當輸入電壓的提升,對加工表面的溫度影響較小,而對預設加工槽區域的溫度影響較大。
若輸入流速較快,則加工速度較慢、過切較小、加工輪廓較對稱、散熱效果較好,蝕刻因子變化不大。當輸入流速達到 9 m⁄s 時,繼續加快輸入流速,對幫助加工區域散熱與改善加工輪廓的對稱性的效果都不大明顯。
陣列槽加工中,如果加工槽距離工件中心越遠,則其加工速度越快、底切越差,而蝕刻因子變化不大;距離工件中心相等距離的加工槽,位於下游者,相較於上游的加工槽,其加工速度較快、底切較差。而造成陣列槽加工的非均勻性之主要原因為邊緣效應使電場強度分布不均所導致。
In view of the research of through mask electrochemical micromachining, it is impossible to detail the cause of the results in the experimental, while most of the simulations only consider a single physical field and machining target, while considering the multiphysics, the effect of Joule heat is seriously underestimated.
Therefore, this research uses the groove arrays as the observation object and corrects the Joule heat to simulate the two-dimensional electric field coupled heat flow field of TMEMM to analyze the machining results in detail.
It is known from the simulation results that if the input voltage is higher, the machining speed is faster, the overcut is poorer, and the etch factor does not change much. When the input voltage is increased, the temperature of the machined surface is less affected, but the temperature of the preset machining groove area is greatly affected.
If the input flow rate is faster, the machining speed is slower, the undercut is smaller, the machining profile is more symmetrical, and the heat dissipation effect is better, and the etch factor does not change much. When the input flow rate reaches 9 m⁄s, the input flow rate continues to increase, which is less effective in helping the machining area to dissipate heat and improve the symmetry of the machining profile.
The machining groove at the same distance from the center of the workpiece, the machining groove located downstream has a faster machining speed and a lower undercut than the upstream machining groove, and the etch factor does not change much. The main reason for the non-uniformity of the groove arrays machining is that the edge effect causes the uneven distribution of the electric intensity.
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