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研究生： 簡建偉
Chien-Wei Chien
論文名稱： 電子構裝用金屬基複合材料之研究
PProcessing and Properties of Metal Matrix Composites for Electronic Peackaging Applications
指導教授： 李勝隆
Sheng-Long Lee
口試委員:
學位類別： 博士
Doctor
系所名稱： 工學院 - 機械工程學系
Department of Mechanical Engineering
畢業學年度： 91
語文別： 中文
論文頁數： 143
中文關鍵詞： 金屬基複合材料 、電子構裝
外文關鍵詞： Metal Matrix Composites, Electronic Package
相關次數： 點閱：8  下載：0 
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    • 摘要
    本論文利用粉末冶金法，製作一系列之金屬基複合材料，研究其製程、微結構，及性質。論文主要分為三大部分，第一部分為熱壓法(Hot Press) 製作高Sip體積分率之Al/Sip複合材料之研究，第二部分為Si預形體(Si Preform)之製作及擠壓浸透法(Squeeze Infiltration)製作高Sip體積分率Al/Sip複合材料之研究，第三部分則為無壓浸透法( Pressureless Infiltration)製作W-15wt.%Cu 複合材料之研究。
    第一部分研究以400及550MPa 之熱壓壓力製作矽體積分率75%~85% 之鋁基複合材料。探討燒結溫度、矽顆粒尺寸，及體積分率對於複合材料性質之影響。實驗結果顯示，以液相燒結法（620℃）製作試片，可達到較高之緻密度、熱傳導性及較佳之抗彎強度。隨著矽顆粒體積分率之增高，複合材料之熱膨脹係數、熱傳導率，及抗彎強度會隨之降低。而在相同之Si體積分率下，較細小之Si顆粒可降低熱膨脹係數並有效提升複合材料之抗彎強度。
    第二部分之研究係以擠壓浸透法製作高Sip體積分率之Al/Sip複合材料；除了探討冷壓壓力對Sip預型體體積分率之影響外，並以物理量測與機械測試等方法，評估Si顆粒尺寸與體積分率對於高Sip體積分率Al/Sip複合材料性質之影響。以40~130MPa之冷壓壓力搭配不同之Si顆粒尺寸，經1000℃，7個小時之燒結，可製作體積分率約60-70%之Sip預型體。而以500℃之模具預熱溫度，搭配750℃之Al合金溶湯以及75MPa之擠壓浸透壓力，可製作緻密度極高之Al/Sip複合材料。經測試，複合材料之各項性質皆隨著Sip體積分率增高而降低；而當Sip體積分率相近時，複合材料之緻密度、熱膨脹係數，以及熱傳導率等性質皆隨著Si顆粒增大而升高，至於抗彎強度，則呈現相反之趨勢。實驗結果顯示，高Sip體積分率之Al/Sip複合材料，兼具低密度、低熱膨脹係數、高熱傳導率，以及適當之抗彎強度，頗具應用於電子構裝領域之潛力。
    第三部分則以無壓浸透法（Pressureless Infiltration），將三種不同粒徑（1μm, 3μm, 21μm）之鎢粉末，在400-550MPa下成型後，於不同燒結溫度下，製作鎢骨架以及W-15wt%Cu複合材料。藉由顯微結構、物理性質、機械性質及抗電弧沖蝕能力的探討，評估鎢顆粒大小對W-15wt%Cu複合材料性質之影響。實驗結果得知，W/Cu複合材料之熱膨脹係數與熱傳導率皆隨著鎢粉顆粒增大而逐漸升高，而電阻係數及鎢骨架之抗彎強度，則隨著鎢顆粒尺寸增大而降低。經定距單弧沖蝕試驗，細鎢顆粒之W/Cu複合材料，其鎢骨架仍完整，而粗鎢顆粒之W/Cu複合材料的鎢顆粒有被沖蝕剝離現象，且經沖蝕後，粗鎢顆粒之W/Cu複合材料的表面粗度遠大於細鎢顆粒之W/Cu複合材料。

    總目錄 摘要 ．．．．．．．．．．．．．．．．．．．．．．．．．． II 總目錄．．．．．．．．．．．．．．．．．．．．．．．．．．．．． IV 圖目錄．．．．．．．．．．．．．．．．．．．．．．．．．XI 表目錄．．．．．．．．．．．．．．．．．．．．．．．．．XVI 第一章 研究背景與文獻回顧．．．．．．．．．．．．．．． 1 1.1 金屬基複合材料簡介 ．．．．．．．．．．．．．．． 1 1.1.1液相製程．．．．．．．．．．．．．．．．．．．．1 1.1.1.1 攪拌鑄造法．．．．．．．．．．．．．．．．．． 3 1.1.1.2 壓力浸透法．．．．．．．．．．．．．．．．．．3 1.1.1.3 擠壓浸透法．．．．．．．．．．．．．．．．．． 3 1.1.1.4 真空吸引浸透法．．．．．．．．．．．．．．．． 5 1.1.1.5 無壓浸透法．．．．．．．．．．．．．．．．． 5 1.1.1.6 超音波浸透法．．．．．．．．．．．．．．．．． 5 1.1.1.7 離心鑄造法．．．．．．．．．．．．．．．．．． 7 1.1.1.8 螺旋擠壓鑄造法．．．．．．．．．．．．．．．． 7 1.1.2固相製程 ．．．．．．．．．．．．．．．．．．．9 1.1.2.1 粉末冶金法 ．．．．．．．．．．．．．．．．．9 1.1.2.2擴散鍵結法．．．．．．．．．．．．．．．．． 9 1.1.3雙相製程 ．．．．．．．．．．．．．．．．．．．9 1.1.3.1 複合鑄造法 ．．．．．．．．．．．．．．．．．9 1.1.3.2 快速凝固法 ．．．．．．．．．．．．．．．．．10 1.1.3.3 噴塗沈積法 ．．．．．．．．．．．．．．．．．10 1.2電子構裝簡介．．．．．．．．．．．．．．．．．．．． 11 1.2.1電子構裝層次 ．．．．．．．．．．．．．．．．．． 11 1.2.2電子構裝技術 ．．．．．．．．．．．．．．．．．． 15 1.2.2.1 電子構裝材料需求特性．．．．．．．．．．．．．．． 17 1.2.2.2電子構裝散熱要求．．．．．．．．．．．．．． 17 1.2.3 電子構裝種類．．．．．．．．．．．．．．．．．． 18 1.2.3.1 晶片接合．．．．．．．．．．．．．．．．．． 18 1.2.3.2 電子構裝聯線．．．．．．．．．．．．．．．． 21 1.2.3.3 BGA構裝．．．．．．．．．．．．．．．．．． 26 1.2.3.4 CSP構裝．．．．．．．．．．．．．．．．．． 27 1.2.3.5 塑膠構裝．．．．．．．．．．．．．．．．．． 29 1.2.3.6 陶瓷構裝．．．．．．．．．．．．．．．．．． 29 1.2.3.7 多晶片模組構裝．．．．．．．．．．．．．．． 30 1.2.3.8 印刷電路板構裝．．．．．．．．．．．．．．． 33 1.2.4電子構裝材料之研究．．．．．．．．．．．．． 33 1.2.5電子構裝用金屬基複合材料性質預估．．．．．．．． 34 1.2.5.1 體積分率 ．．．．．．．．．．．．．．．．． 34 1.2.5.2 理論密度 ．．．．．．．．．．．．．．．．． 35 1.2.5.3 熱膨脹係數 ．．．．．．．．．．．．．．．． 35 1.2.5.4熱傳導率 ．．．．．．．．．．．．．．．．．．36 1.3 電接觸材料簡介．．．．．．．．．．．．．．．． 38 1.3.1電接觸材料之性質要求．．．．．．．．．．．．．．．．． 38 1.3.2電接點之破壞模式．．．．．．．．．．．．．．．．．．． 40 1.3.3W/Cu複合材料於電接觸材料領域之應用．．．．．．．．． 41 1.3.4電弧沖蝕模式．．．．．．．．．．．．．．．．．．．． 43 1.4 研究目的．．．．．．．．．．．．．．．．．．．．．．．． 46 第二章 熱壓(Hot Press)製作高Si體積分率Al/Sip複合材料之研 究．．．．．．．．．．．．．．．．．．．．．．．．．．．．． 48 2.1前言．．．．．．．．．．．．．．．．．．．．．．．． 48 2.2 實驗方法步驟．．．．．．．．．．．．．．．．．．．49 2.2.1 調配組成及混粉．．．．．．．．．．．．．．． 49 2.2.2 熱壓燒結．．．．．．．．．．．．．．．．．． 54 2.2.3 物理性質量測．．．．．．．．．．．．．．．． 57 2.2.3.1密度量測．．．．．．．．．．．．．．．．．．．．． 57 2.2.3.2熱膨脹係數(CTE)量測．．．．．．．．．．．．．．． 58 2.2.3.3熱傳導係數(TC)量測．．．．．．．．．．．．．．．． 58 2.2.4 機械性質試驗．．．．．．．．．．．．．．．．．． 58 2.2.5 微結構分析．．．．．．．．．．．．．．．．．．． 60 2.3 結果與討論 ．．．．．．．．．．．．．．．．．．． 60 2.3.1微結構分析 ．．．．．．．．．．．．．．．．．．．．．60 2.3.2 Al/Sip複合材料之物理性質．．．．．．．．．．．．．．． 61 2.3.2.1 熱膨脹係數 ．．．．．．．．．．．．．．．．．．．61 2.3.2.2 熱傳導率．．．．．．．．．．．．．．．．．．．． 61 2.3.3 Al/Sip複合材料之機械性質．．．．．．．．．．．．．．．． 62 2.3.4 Al/Sip複合材料應用於電子構裝領域可行性之評估．．．．． 62 2.4 結論．．．．．．．．．．．．．．．．．．．．．．．．．． 67 第三章 擠壓浸透法(Squeeze Infiltration)製作高Si體積分率Al/Sip複合材 料之研究．．．．．．．．．．．．．．．．．．．．．．．．．． 68 3.1前言 ．．．．．．．．．．．．．．．．．．．．．．．．．．68 3.2 實驗方法與步驟．．．．．．．．．．．．．．．．．．．．．69 3.3 結果與討論．．．．．．．．．．．．．．．．．．．．．．．70 3.3.1 微結構分析 ．．．．．．．．．．．．．．．．．．．．． 70 3.3.2 Al/Sip複合材料之物理性質．．．．．．．．．．．．．．． 71 3.3.2.1 熱膨脹係數．．．．．．．．．．．．．．．．．．．．71 3.3.2.2 熱傳導率 ．．．．．．．．．．．．．．．．．．．． 72 3.3.3Al/Sip複合材料之機械性質．．．．．．．．．．．．．．． 72 3.3.4Al/Sip複合材料應用於電子構裝領域可行性之評估 ．．．．．73 3.4 結論．．．．．．．．．．．．．．．．．．．．．．．．．． 79 第四章 無壓浸透法製作W/Cu 複合材料之研究．．．．．．．．．．． 80 4.1前言．．．．．．．．．．．．．．．．．．．．．．．．．80 4.2實驗方法與步驟．．．．．．．．．．．．．．．．．．．．81 4.2.1 W骨架燒結．．．．．．．．．．．．．．．．．．．．．． 81 4.2.1.1 粉末準備 ．．．．．．．．．．．．．．．．．．．． 81 4.2.1.2 混粉． ．．．．．．．．．．．．．．．．．．．．． 81 4.2.1.3 預壓．．．．．．．．．．．．．．．．．．．． ．． 86 4.2.1.4 預燒．．．．．．．．．．．．．．．．．．．．．． 86 4.2.1.5 燒結．．．．．．．．．．．．．．．．．．．．．． 87 4.2.2 無壓浸透．．．．．．．．．．．．．．．．．．．．．．． 91 4.2.3 物理性質量測．．．．．．．．．．．．．．．．．．．．．91 4.2.3.1 密度量測．．．．．．．．．．．．．．．．．．．． 91 4.2.3.2 熱膨脹係數量測．．．．．．．．．．．．．．．．． 93 4.2.3.3 電阻率之量測與熱傳導率之轉換．．．．．．．．．． 93 4.2.4機械性質量測．．．．．．．．．．．．．．．．．．． 93 4.2.4.1 彎曲試驗．．．．．．．．．．．．．．．．．．．． 93 4.2.4.2 硬度量測．．．．．．．．．．．．．．．．．． ．．94 4.2.5耐電弧沖蝕能力試驗．．．．．．．．．．．．． 94 4.2.6微結構分析．．．．．．．．．．．．．．．．．． 96 4.3 結果與討論．．．．．．．．．．．．．．．．．．．．．． 96 4.3.1 微結構分析．．．．．．．．．．．．．．．．．．．．． 96 4.3.2 W/Cu複合材料之物理性質．．．．．．．．．．．．． ． 98 4.3.2.1 緻密度．．．．．．．．．．．．．．．．．．．．． 98 4.3.2.2 熱膨脹係數．．．．．．．．．．．．．．．．． ． 98 4.3.2.3 電阻率．．．．．．．．．．．．．．．．．．． ． 102 4.3.2.4 熱傳導率．．．．．．．．．．．．．．．．．．． ． 102 4.3.3 W/Cu複合材料之機械性質．．．．．．．．．．．．．．． 102 4.3.3.1 W骨架之彎曲試驗分析．．．．．．．．．．．．．． 102 4.3.3.2 W/Cu複合材料破斷面之微結構及硬度分析．．．．．． 105 4.3.4 W/Cu複合材料之抗電弧沖蝕能力．．．．．．．．．．． 108 4.4 結論．．．．．．．．．．．．．．．．．．．．．．．．．．116 第伍章 總結論．．．．．．．．．．．．．．．．．．．．．．117 第陸章 未來研究方向．．．．．．．．．．．．．．．．．．．118 第七章 參考文獻 ．．．．．．．．．．．．．．．．．．．．．．．119

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