熱介面材料 (TIMs) 是大多數電力電子系統的關鍵部件，熱由高功率電子元件產生，必須轉移到一個散熱器，並最終消散到周圍環境，在這項工作中使用一種通用且無溶劑的球磨方法，減少市面販售之石墨烯粉末(Exfoliated Graphite Nanoplatelets，EGN)的平均粒徑，產生高品質之球磨石墨烯粉末(Ball-Milled Exfoliated Graphite Nanoplatelets，BMEGN) ，並利用網印技術，將不同球磨時間石墨烯粉末之嵌入聚二甲基矽氧烷(PDMS)，製成熱介面材料。
比較添加 BMEGN 對TIMs熱傳導係數的影響，從0到48小時球磨時間填料的熱傳導係數進行觀察，平面方向熱傳導係數由12.8 W/mK增加至16.9W/mK，垂直方向熱傳導係數由0.75 W/mK增加至1.19 W/mK，此外；熱介面材料具有突出機械性能以及熱穩定性，能符合各種指定的環境，熱傳導係數和優異的機械性能的結合可以促進熱管理的應用，本研究針對自製之熱介面材料進行一系列的實驗，首先將不同時間之球磨石墨烯粉末進進行掃描式電子顯微鏡(SEM)以及穿透式電子顯微鏡(TEM)觀察其微觀組織變化，而將熱介面材料進行散熱實測，利用功率為20W之散熱墊片與鋁鰭片，將熱介面材料夾在其中，利用熱電偶觀察其散熱效果，並且實際應用於核研所現有之15kW電力轉換器與鋁散熱鰭片之間進行溫度散熱量測。

Thermal interface materials (TIMs) is a key component in the majority of power electronic systems. Heat, generated by the semiconductors, has to be transferred to a heat sink and finally dissipated to ambient. In this work, we report a versatile and solvent-free method for the particle size reduced of exfoliated graphite nanoplatelets (EGN) into high-quality ball-milled exfoliated graphite nanoplatelets (BMEGN) by simple solid-state ball-milling, fillers are embedded and thermally cured with Polydimethylsiloxane (PDMS) to make a highly stretchable BMEGN-embedded Polydimethylsiloxane (PDMS)-TIMs (BMEGN/PDMS) with improved thermal conductivity and mechanical properties.
The thermal conductivity was observed for BMEGN fillers with 0~48h ball mill time and an enhanced in-plane thermal conductivity of 12.8~16.9W/mK and through-plane thermal conductivity of 0.75~1.19 W/mK can be experimentally measured. exhibits synergetic mechanical properties with outstanding flexibility. The combination of thermal conductivity and superior mechanical performance may facilitate the applications in thermal management

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