後疫情時代， 美中貿易競爭下，形成分明壁壘的政治局面影響各國半導體產業政策，紛紛從全球化分工轉變成積極發展半導體自主。同時5G、AI及高效能運算技術不斷進步；智慧醫療、智慧城市及智慧農業等，多種智慧產業加速發展，增加各產業對IC的需求。半導體產業朝向多方面蓬勃發展，台灣廠商因為半導體產業鏈完整，因而成為熱門的合作對象。
全球半導體市場競爭強勁，IC封測產業需嚴控產品開發週期，才能協助客戶爭取市場先機。因此迅速、有效率地選擇合適的供應商，讓所有材料及時交付，便成為供應商管理重要課題。IC封測產業負責將整片布線完成的晶圓切割成單顆晶粒，再用樹脂、塑膠及陶瓷等材料進行封裝，保護晶粒免受汙染。使用的材料類別中，包裝材料占的成本比重較低，但具有比其他材料更龐大的體積。如果缺少包裝材料，即使IC加工完成，亦無法如期地交付到客戶手中。包裝材料產業純熟，市場上存在眾多潛在供應商，使得供應商評選變得繁複。因此建立一套可靠的包裝材料供應商評估機制，有助IC封測企業迅速地評選出合適的包裝材料供應商。
本研究採用層級分析法(Analytic Hierarchy Process；AHP)，針對IC封測產業的「包裝材料供應商評選」進行準則評選及權重評估。首先研讀歷史供應商評選文獻的構面及準則，接著進行專家訪談及意見整合，以此建立包裝材料的供應商評選機制。再歸納出各構面及準則之間的權重值，作為日後IC封測產業在「包裝材料評選供應商」作業之決策依據。

In the post-epidemic era, the trade competition between the United States and China, the semiconductor industry has formed a situation of clear barriers by geopolitics. The policies of the semiconductor industry in many countries has been changed, from global division manufacturing to start to actively develop the semiconductor industry by themselves. 5G, AI and high-performance computing technologies continue to progress, and smart industries such as smart healthcare, smart cities, and smart agriculture are all accelerating development, increasing the demand ICs come with huge increases in various industries, and provide multi-function development of global semiconductors. And since Taiwanese manufacturers have a complete supply chain of semiconductors, we become the most popular partners now.
In a strong competitive environment of the world, and the IC packaging and testing industry needs to strictly control the product and development cycle to strive for market opportunities. Therefore, quickly and efficiently selecting the right suppliers so that all materials can be delivered in a time has become an important issue in supplier management. The IC packaging and testing industry is responsible for cutting the entire processed wafer into single grains, then molded with resin, plastic, ceramics, and other materials to protect the grains from contamination. Among the categories of material used, packaging materials are a lower proportion of the cost and have a larger volume than other materials. But if there is a shortage of packaging materials, even if the IC processing is completed, it cannot be delivered to the customer as scheduled. The packaging material industry is complex, and there are many potential suppliers, which makes it more difficult to supplier selection. The establishment of a reliable packaging material supplier evaluation mechanism in the IC packaging industry can help enterprises select suitable packaging material suppliers more efficiently.
The Analytic Hierarchy Process was used in this study, aiming at the " selection of packaging material suppliers " problem in the IC packaging and testing industry, and evaluating and discussing the weight of the selected indicators. First, refer to the criteria and attributes of historical documents, interview experts and integrate expert opinions, and establish a supplier selection mechanism for packaging materials. Then summarize the weight value between the criteria and attributes, which will be used as the basis for the future decision-making of the IC packaging and testing industry in the selection of suppliers of packaging materials.

一、 中文部分
〔1〕陳怡如：工業技術與資訊月刊370期〈科技大風吹向移動載具、元宇宙〉，2023年2月15日，取自https://www.itri.org.tw/ListStyle.aspx?DisplayStyle=18_content&SiteID=1&MmmID=1036452026061075714&MGID=1216243222215110666。
〔2〕黃欽勇：DIGITIME Research〈話說天下大勢(2)：台灣半導體產業的三本柱〉，2023年4月7日，取自https://www.digitimes.com.tw/col/article.asp?id=10255。
〔3〕產業價值鏈資訊平台，取自https://ic.tpex.org.tw/introduce.php?ic=D000。
〔4〕SGS歐盟和美國包裝材料禁限用物質測試服務，取自https://eecloud.sgs.com/Region_TW/service/service.aspx?ID=PACKING_TEST。
〔5〕台灣積體電路製造股份有限公司：〈供應商物料包裝規範白皮書Version 1.4〉，2022。
〔6〕ANSI/ESD S20.20：2021。
〔7〕鄧振源，曾國雄，「分析層級法的內涵特性與應用（上）」，中國統計學報，二十七卷六期，5-27，1989年。
〔8〕張紹勳：《模糊多準則評估法及統計》，初版，台北市，五南圖書，2012年。
〔9〕周明芳：〈IC 設計業供應商評選之研究〉。碩士論文，國立臺北科技大學，民國105年6月。
〔10〕陳逸蓉：〈半導體材料與設備供應商評選決策之研究-以Ａ公司為例〉。碩士論文，國立高雄大學，民國105年6月。
〔11〕彭明威：〈運用FAHP探討供應商評選機制之研究—以半導體封裝測試廠為例〉。碩士論文，中華大學，民國106年8月。
〔12〕趙桂明：〈半導體製程設備耗材供應商評選分析法〉。碩士論文，國立中央大學，民國107年6月。
〔13〕黃峻韋：〈探討臺灣半導體封裝測試業包裝材料供應商評選準則之研究-以PXXX公司為例〉。碩士論文，中國科技大學，民國109年10月。
〔14〕許婷甄：〈評選晶圓封裝之焊錫球供應商模糊多準則評估之研究〉。碩士論文，國立雲林科技大學，民國111年1月。
〔15〕簡志郎：〈模糊理論與TOPSIS法於失效模式與效應分析之應用〉。碩士論文，逢甲大學，民國92年1月。
〔16〕許振邦，《採購與供應管理》，三版，台北市，智勝文化，2013年1 月。
 
二、 英文部分
〔17〕Saaty,T.L., “The Analytic Hierarchy Process”, McGraw Hill Internal Book, New York, 1980.
〔18〕Dickson, G. W., “An Analysis of Vendor Selection Systems and Decisions”, Journal of Purchasing, 2(4), 563-588, 1966.
〔19〕Weber, C. A., Current, J. R. and Benton, W. C., “Vendor Selection Criteria and Method”, European Journal of Operational Research, 50(1), 2-18, 1991.
〔20〕Ellram, L. M., “The Supplier Selection Decision in Strategic Partnerships”, Journal of Purchasing and Materials Management, 26(4), 8-14, 1990.
〔21〕Wilson, E. J., “The Relative Importance of Suppliers Selection Criteria: A Review and Update”, International Journal of Purchasing and Materials Management, 30(3), 35-41, 1994.
〔22〕F.T.S. Chan and H.K. Chan, “Development of the Supplier Selection Model—A Case Study in the Advanced Technology Industry”, December 2004.
〔23〕Kang, H.Y. and Lee, A.H.I., "A New Supplier Performance Evaluation Model：A 61 Case Study of Integrated Circuit (IC) Packaging Companies," Kybernetes, Vol. 39, Issue1, 37-54, 2010.
〔24〕Jeonghwan Jeon , Hakyeon Lee and Yongtae Park, “Implementing Technology Roadmapping with Supplier Selection for Semiconductor Manufacturing Companies”, Technology Analysis & Strategic Management, 899-918, 2011.
〔25〕Kang, H.Y., Lee, A.H.I. and Yang, C.Y., “A Fuzzy ANP Model for Supplier Selection as Applied to IC Packaging” , Journal of Intelligent Manufacturing, Vol.23, No. 5, 1477-1488, 2012.
〔26〕Hwang, C.L. and Yoon, K., “Multiple Attribute Decision Making: Methods and Application”, Springer-Verlag, New York, 1981.
〔27〕Vaidya, Omkarprasad S. and Kumar, Sushil, 2006. “Analytic Hierarchy Process: An Overview of Applications,” European Journal of Operational Research, vol. 169(1), 1-29, February 2006.