科技發展突飛猛進的今日，芯片技術的成熟帶來了科技的大躍進，現代人已經幾乎不可能不用到芯片，不管是電腦、手機或是其他智能家電已成為生活中不可缺少的一部份。而芯片的突破主要仰賴在半導體製程，而局部電化學沉積即是一種，局部電化學沉積容易製作高深寬比的立體結構物、能使用不同原料、能常溫常壓下製作、利用堆積材料成型能降低更多成本、減少浪費，可說此技術是種高應用性、低成本、低耗能、低汙染又安全製造技術。
本論文延續了「影像導引局部電化學沉積」及「異軸式雙螺旋演算法」之概念，在其基礎上改善陰陽極製做方式，使其能夠製作微米等級尺寸雙螺旋微結構物，並減少出錯機會。打造實驗數據紀錄模組，紀錄並分析各參數之改變對於成品之影響。模擬電鍍過程中，各種電化學沉積參數對雙螺旋影響。改良設備與製程，提高此系統的可靠度及成功率。發展可變螺距雙螺旋及可控柱徑雙螺旋電鍍系統。最後由形貌、電鍍時間、表面電場模擬、最大步進旋轉角度測試以及柱徑變化這幾方面來做分析與討論。

Nowadays, thanks to the well-developed chip technology, the science and technology has been improved by leads and bounds. Any smart home appliance that is made of chip has become indispensable part of modern life, such as computers, smartphones, et cetera. In fact, the breakthrough of chip technology mainly depends on the semiconductor processes, one of which is Local Electrochemical Deposition. Local Electrochemical Deposition is prone to produce a high aspect ratio stereo structure. Moreover, it can also use different materials and can be conducted under normal temperature and pressure. Furthermore, this process can form products by using stacked materials, which can lower the cost and reduce the waste at the same time. Consequently, Local Electrochemical Deposition is definitely a highly applicable, low-cost, low-energy, low-pollution, and safe manufacturing technology.
This paper is based on the concept of "image-guided local electrochemical deposition" and "non-isoaxial double-helix algorithm". We improved the anode-anode manufacturing method, enabling it to fabricate micro-scale double-helix microstructures, thus reducing the chance of system errors. Apart from it, we created an experimental data record module which records and analyzes the impact of changes in each parameter on the finished product. In addition, we simulated the effects that various electrochemical deposition parameters caused on double helix during the electroplating process. Also, we made an improvement of the equipment and the manufacturing process to enhance the reliability and the success rate of this system. And developed variable pitch double helix and controllable cylindrical double spiral plating system. At last, we carried out the analysis and discussion on the aspects of morphology, plating time, surface electric field simulation, maximum step rotation angle test and column diameter change.

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