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研究生: 許書豪
Shu-Hao Hsu
論文名稱: 非揮發性鍺量子點掩埋於二氧化矽/氮化矽複合穿隧介電層之MOS電容研製與載子傳輸機制之探討
Fabrication and Carrier Transport Mechanism of Nonvolatile Germanium Quantum Dots Imbedded in Oxide-Nitride Composite Tunnel Dielectric MOS-Capacitors
指導教授: 李佩雯
Pei-Wen Li
口試委員:
學位類別: 碩士
Master
系所名稱: 資訊電機學院 - 電機工程學系
Department of Electrical Engineering
畢業學年度: 96
語文別: 中文
論文頁數: 70
中文關鍵詞: 非揮發性記憶體
外文關鍵詞: nonvolatile memory
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  • 本論文旨在探討單層和雙層鍺量子點的閘堆疊,高介電係數材料應用,以及由兩個不同能隙的介電層堆疊,所產生的階梯形能障所帶來的優缺點,並藉由分析載子在複合介電層的傳輸機制,來了解電荷在複合穿隧介電層的傳輸機制對非揮發記憶體的效能影響。在分析後可以知道,在元件操作的電場區域,電子在介電層的傳輸機制,單層是氮化矽F-P穿隧與二氧化矽F-N穿隧的串聯,由氮化矽主導;雙層亦是氮化矽F-P穿隧與二氧化矽穿隧的串聯,由二氧化矽主導。


    This article investigates the integration of multi-layer Ge QDs, high-K material, composite dielectrics and stair-case energy barrier for nonvolatile memory, and analyzes the advantages and disadvantages of the MOS-capacitors with these terms of charge storage, retention, and endurance. Furthermore, we analyze the carrier transport mechanism in the composite dielectrics.

    第一章 緒論 1-1 前言...........................p1 1-2 研究動機.........................p2 1-3 研究目的與應用......................p4 第二章 單/雙層鍺奈米晶粒MIS 結構的製程開發與製作 2-1 前言...........................p7 2-2 鍺奈米晶粒製作方法....................p7 2-3 複晶矽鍺沉積在不同介電薄膜的物理性質...........p8 2-3-1 前言.......................p8 2-3-2 沉積矽鍺薄膜之潛伏期...............p8 2-3-3 複晶矽鍺沉積在二氧化矽薄膜上的物理性質......p9 2-3-4 複晶矽鍺沉積在非晶矽薄膜上的物理性質.......p9 2-3-5 複晶矽鍺沉積在氮化矽薄膜上的物理性質.......p10 2-4 元件結構與完整製程流程..................p11 2-5 元件結構設計與結果探討..................p12 第三章 電荷穿隧機制分析與探討 3-1 前言與動機........................p24 3-2 穿隧機制.........................p25 3-2-1 直接穿隧機制...................p25 3-2-2 Fowler-Nordheim 穿隧機制.............p26 3-2-3 Frenkel-Poole 穿隧機制...............p26 3-2-4 穿隧機制結論...................p26 3-3 單層與雙層結構穿隧電流機制討論..............p27 3-3-1 電流趨勢初步分析比較...............p27 3-3-2 單層結構電流穿隧機制討論.............p28 3-3-3 雙層結構電流穿隧機制討論.............p30 第四章 多層量子點的記憶體特性分析 4-1 前言...........................p41 4-2 單層與雙層鍺量子點電容CV loop 量測............p41 4-3 儲存時間量測分析.....................p44 4-4 浮點電晶體元件特性討論..................p46 第五章 總結與未來展望......................p56 參考文獻.............................p57

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