本篇論文建立一套非接觸式、非破壞性的檢測物體內部缺陷深度與半徑的方法，利用在鎖相熱成像法中在物體輸入周期性變化的熱功率的特性導入熱波原理，藉由熱波原理控制檢測的深度。並根據有限元素分析軟體對不同缺陷深度與半徑進行模擬的結果建立一套使用週期性熱功率量測物體後，可以從量測的結果推算出在物體內部缺陷分布情形，並且同時得知缺陷深度與半徑的方法，最後進行實驗對模擬的結果進行確認。

This research successfully builds a non-destructive, non-contact detection method of determining the internal defect depth and defect radius in samples. In lock-in thermography method, the samples are measured by periodically changed heat flux. The effect about periodically changed heat flux is known as thermal wave effect. As thermal wave effect shows, the detection depth is related with the frequency of heat flux By finite element analysis software, the defect depth and defect radius we can be measured after using two difference frequency heat power detect a sample. The simulation results are proved by experiment.

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