在競爭激烈的半導體產業中，以接單為主的的晶圓代工廠為了滿足顧客的交期，達交率已成為晶圓代工廠是非常重要的指標。砷化鎵晶圓製造廠的生產模式與矽晶圓製造廠極為類似，但由於產品與技術的複雜度較高，並無法達到經濟生產規模；另由於設備自動化程度低和生產參數控制的敏感度高，也使得生產效率和穩定性相對不佳。相對於大型半導體廠的生產管理改善，已有許多的研究探討；但對於不同規模和特性的半導體產線而言，並無法直接套用相關之研究成果。
本研究之目標為發展出提高設備稼動率及滿足客戶交期的目標，發展出針對不同規模和特性的半導體製造廠生產效率及管理改善模式成提高設備稼動率及滿足客戶交期的目標。

Semiconductor industry is a very competitive industry. The make-to-order semiconductor fab in order to satisfy customer's delivery date, it is very important performance measure in a make-to-order fab. GaAs fab production mode is very similar to the silicon fab, but because of the high complexity of the products and technologies and is does not achieve economies of scale of production. The application of automation to semiconductor equipment is low and production recipe control sensitivity is high, it causes poor production efficiency and stability. To improve the production control of the large semiconductor fab, there are many related exploration and research. For semiconductor production lines of different modules and characteristics, they can’t be directly applied to the relevant research results.
The research purpose is to improve equipment utilization rate and meet customer delivery targets
Establish a factory production efficiency for different size and characteristics of the semiconductor and management improvement model to improve equipment utilization rate and meet customer delivery targets.

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