先進半導體封裝已成為實現晶片微縮和提升效能的關鍵技術，面對全球高階半導體
技術快速演進，台灣在此領域已取得領先成果，然而未來如果想繼續維持技術優勢，需
依賴關鍵的國際合作夥伴。日本長期以來為台灣半導體產業的重要合作對象，尤其在半
導體材料與設備方面具備深厚實力，， 然而目前多數研究仍聚焦於兩國在邏輯晶片上的合
作，對於雙方在先進封裝領域的合作探討仍顯不足，因此本研究著重於台日兩國在 3D
IC 技術上的合作潛力與發展性。
本研究統整台灣與日本半導體產業之相關文獻，並分析3D封裝技術的關鍵技術與
發展脈絡，進而針對三項核心研究問題進行深入探討：
一、探討台日半導體產業的技術互補性及合作的必要性
二、分析台日半導體產業3D IC技術發展的現況。
研究以2005年至2024年間，台灣與日本於美國專利商標局（USPTO）申請之3D
IC 相關專利為資料來源，並運用Python與Excel進行量化分析。透過t檢定方法驗證雙
方在3D IC技術發展上的成長趨勢，並進一步以專利的國際專利分類(IPC)相似度分析，，
探討雙方的技術重疊程度與合作潛力。研究結果顯示，兩國在近十年間於3D IC技術領
域的專利申請數量顯著增加，顯示該技術已成為雙方關注的策略重點；然而技術相似度
長期維持在低水平，反映出台日雙方具高度技術互補性與合作空間。本研究結果可為未
來台日3D IC技術合作提供實證基礎，亦對政府政策與產業策略制定具參考價值。

Advanced packaging has become a key technology in achieving chip miniaturization and
performance enhancement. In the face of rapid evolution of global high-end semiconductor
technologies, Taiwan has attained a leading position. However, sustaining its technological ad
vantage in the future will require strategic international partnerships. Japan, as a long-standing
partner of Taiwan’s semiconductor industry, possesses strong capabilities in semiconductor’s
materials and equipment technologies. While existing studies have primarily focused on bilat
eral collaboration in logic chip development, there is a notable lack of research on collaboration
in advanced packaging technologies. Therefore, this study focuses on exploring the potential
and development of Taiwan-Japan collaboration in 3D IC.
This research begins by reviewing relevant literature on the semiconductor industries of
Taiwan and Japan, as well as identifying the key technologies and development trends in 3D
packaging. It addresses the following three core research questions:
1.
2.
To analyze the current state of 3D IC technology development in the semiconductor in
dustries of Taiwan and Japan.
To discuss the technological complementarity between Taiwan and Japan's semiconductor
industries and the necessity for collaboration between the two countries.
The study applied data on 3D IC-related patents filed by Taiwanese and Japanese entities
with the United States Patent and Trademark Office (USPTO) from 2005 to 2024. Quantitative
analysis was conducted using Python and Excel. A t-test was applied to examine the growth
trend of 3D IC technology development in both countries. Furthermore, IPC (International Pa
tent Classification) similarity analysis was employed to evaluate the extent of technological
overlap and the potential for collaboration. The results show that the number of 3D IC-related
patent applications from both countries has significantly increased in the past decade, indicating
ii
that this technology has become a strategic focus for both industries. However, the long-term
low level at technological similarity suggests a high degree of technological complementarity,
underscoring the potential for bilateral collaboration. These findings provide empirical evi
dence supporting future Taiwan-Japan collaboration in 3D IC technology and offer valuable
insights for government policy and industry strategy development.

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