新型熱熔膠拋光墊的研製及其對單晶矽與不銹鋼材料之拋光研究

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研究生：	蔡松霖 Sung-lin Tsai
論文名稱：	新型熱熔膠拋光墊的研製及其對單晶矽與不銹鋼材料之拋光研究 A study on the manufacturing of new hot melt adhesive polishing pad and its effects on polishing monocrystalline silicon and stainless steel workpiece
指導教授：	顏炳華 Biing-hwa Yan
口試委員:
學位類別：	博士 Doctor
系所名稱：	工學院 - 機械工程學系 Department of Mechanical Engineering
畢業學年度：	99
語文別：	中文
論文頁數：	120
中文關鍵詞：	磁性流體、單晶矽、表面粗糙度值、熱熔膠、拋光墊
外文關鍵詞：	surface roughness, silicon, Hot melt adhesive, Polishing pad, Magnetic compound fluid
相關次數：	點閱：8 下載：0
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拋光墊(Polishing pad)的應用是使工件達到精微表面拋光，可有效
移除工件表面凹凸及平坦化的效果。拋光墊的發展可追溯至人類遠古
時期對於玉、青銅器及寶石的鏡面拋光。近年隨著半導體技術發展與
應用，半導體晶圓等材料表面的精密拋光亦顯重要，拋光墊的發展也
日新月異。目前眾多研磨拋光的發展，通常以針對拋光條件或拋光機
制進行探討居多，對於開發新式拋光墊的研究文獻甚少。本研究針對
此課題，利用實際製作拋光墊與拋光實驗，深入分析探討其對工件表
面形貌的影響。
在實驗方面，本研究研製了新型熱熔膠拋光墊(Hot melt adhesive
pad, HMA pad)並以其對單晶矽進行拋光實驗，同時亦利用磁性流體
(Magnetic compound fluid, MCF)對SUS-304 不銹鋼工件進行研磨拋光
實驗。研究結果發現，自製熱熔膠拋光墊噴塗距離的控制攸關拋光墊
的好壞與性質；不同披覆磨粒型態的熱熔膠拋光墊，其中以混合磨粒
含量5w.t%者對於研磨單晶矽有較佳的表面粗糙度與均勻度。對於單
晶矽次表面層的研究發現，損傷層約100-150 nm、非晶矽層約10 nm。
由磁性流體對單晶矽表面研磨研究發現，磁性流體對改善表面形貌的
效果非常顯著，表面粗糙度由初始0.25μm 降至0.031μm。而藉由配
製磁性流體的研究發現，配製磁流體以矽油黏度1000 mm2/s 含量30g、
羰基鐵粉含量20g、四氧化三鐵含量1g、氧化矽含量0.1g 及矽烷偶
聯劑含量1g 可獲得6 小時的懸浮效果；SUS-304 不銹鋼經熱熔膠拋
光墊結合磁性流體研磨，其表面粗糙度值可降至0.068 μm。利用兩磁
極方式(相吸、相斥)皆較單磁極有較佳的研磨效果。

Polishing pad is an effective tool for polishing workpiece by
removing roughness on the surface. Use of polishing pad can be traced
back to the ancient mirror polishing of objects of jade, bronze and
precious stone. With the development and application of semiconductor
production technology and wafer surface polishing the development of
polishing pads is also growing in fast pace. While a lot of researches on
the polishing conditions and mechanisms have been conducted few
studies can be found with the making of new polishing pads. This study
focuses at the combined effects on surface profiles of workpieces
polished by newly developed polishing pads and polishing conditions.
This study employs custom made hot melt adhesive (HMA) pad to
polish silicon workpiece surface and SUS-304 stainless surface together
with magnetic compound fluid (MCF). The experiments results show that
the quality of HMA pad is highly dependent upon the spraying distance
when coating pad surface. Surface of HMA pad coated with 5 w.t%
grain mixture is of better surface roughness and uniformity (WIWNU)
when polishing silicon workpiece. With respect to sub-surface layer of
silicon workpiece it is found that the thickness of damage layer is around
100-150 nm and the amorphous silicon layer around 10 nm. When
applying MCF polishing to silicon workpiece it is found that better
surface quality may be improved as well. For magnetic compound fluid
used in stainless workpiece polishing it is found that a mixture of 30 gram
silicon oil with 1000 mm2/s viscosity, 10 gram of carbonyl iron powder,
1 gram of ferric ferrous oxide, 0.1 gram silica and 1 gram of Silane
coupling agent may give a 6-hour may reach a suspension effect up to 6
hours. Surface roughness of SUS-304 stainless workpiece may be
reduced to 0.068 μm after polished by HMA pad together with MCF as
dual magnetic poles (either attraction or repulsion) always led to better
iii
polishing results when compared with single magnetic pole one.

摘 要 ........................................................................................................... i
Abstract ........................................................................................................ ii
謝 誌 ......................................................................................................... iv
目 錄 .......................................................................................................... v
圖目錄 .......................................................................................................... x
表目錄 ....................................................................................................... xiii
第一章 緒論................................................................................................ 1
1-1 研究背景 ....................................................................................... 1
1-2 研究動機與目的 ............................................................................ 3
1-3 文獻回顧 ........................................................................................ 4
1-4 研究方法 ........................................................................................ 7
1-5 本論文之構成 ................................................................................ 9
第二章 熱熔膠拋光墊研製及對單晶矽拋光研究 ................................. 10
2-1 前言 .............................................................................................. 10
2-2 拋光墊簡介 .................................................................................. 11
2-2-1 拋光墊材料特性 ............................................................... 11
2-2-2 拋光墊種類 ....................................................................... 12
2-2-3 發泡體製作成型分類 ...................................................... 15
2-3 實驗設備與方法 .......................................................................... 16
2-3-1 實驗設備 ........................................................................... 16
2-3-2 實驗材料 ........................................................................... 18
2-3-3 實驗步驟 ........................................................................... 22
2-3-4 實驗參數設定 ................................................................... 25
2-4 實驗流程 ...................................................................................... 26
2-5 結果與討論 .................................................................................. 27
2-5-1 拋光墊性質探討 ............................................................... 27
2-5-1-1 噴塗距離對拋光墊型成的影響 ....................... 27
2-5-1-2 拋光墊的拋光測試 ........................................... 28
2-5-1-3 拋光墊性質分析 ............................................... 30
2-5-1-4 動態機械分析 ................................................... 30
2-5-2 拋光單晶矽試片參數探討 .............................................. 31
2-5-2-1 加工進给速率對表面粗糙度的影響 ............... 31
2-5-2-2 軸向荷重對表面粗糙度的影響 ....................... 32
2-5-2-3 主軸轉速對表面粗糙度的影響 ........................ 33
2-5-3 拉曼光譜分析 ................................................................... 34
2-5-4 矽晶片研拋效果 ............................................................... 36
2-6 結論 .............................................................................................. 37
第三章 不同披覆磨粒方式的熱熔膠拋光墊對單晶矽拋光研究 ......... 38
3-1 前言 .............................................................................................. 38
3-2 田口品質工程 .............................................................................. 40
3-2-1 田口實驗設計法 ............................................................... 40
3-2-2 ANOVA 變異數分析 ......................................................... 41
3-3 實驗設計與方法 .......................................................................... 42
3-3-1 實驗步驟與流程 ............................................................... 42
3-3-2 表面粗糙度與WIWNU 的量測 ...................................... 45
3-4 實驗流程 ...................................................................................... 46
3-5 結果與討論 .................................................................................. 47
3-5-1 熱壓式披覆磨粒熱熔膠拋光墊 ....................................... 47
3-5-1-1 披覆溫度對披覆效果的影響 ........................... 47
3-5-1-2 披覆粒徑對披覆效果的影響 ........................... 49
3-5-1-3 披覆壓力對披覆效果的影響 ........................... 51
3-5-1-4 披覆時間對披覆效果的影響 ........................... 51
3-5-2 田口實驗結果分析............................................................ 53
3-5-2-1 表面粗糙度分析 ............................................... 54
3-5-2-2 WIWNU 分析 ................................................. 55
3-5-2-3 驗證實驗 ........................................................... 57
3-5-3 表面粗糙度之參數因子分析 ........................................... 58
3-5-3-1 披覆粒徑對表面粗糙度的影響 ....................... 58
3-5-3-2 磨粒濃度對表面粗糙度的影響 ....................... 58
3-5-3-3 軸向荷重對表面粗糙度的影響 ....................... 61
3-5-4 WIWNU 之參數因子分析 ................................................ 63
3-5-4-1 預泡時間對WIWNU 的影響 .......................... 63
3-5-4-2 磨粒濃度對WIWNU 的影響 .......................... 63
3-5-4-3 主軸轉速對WIWNU 的影響 .......................... 65
3-5-5 混合式披覆磨粒熱熔膠拋光墊 ....................................... 66
3-5-5-1 加工時間對表面粗糙度改善效果 .................... 67
3-5-5-2 不同拋光墊對WIWNU 改善效果 ................... 68
3-5-6 EDS 分析 ........................................................................... 69
3-6 結論 .............................................................................................. 71
第四章 熱熔膠拋光墊結合磁性流體之拋光研究 ................................. 72
4-1 前言 .............................................................................................. 72
4-2 磁性流體簡介 .............................................................................. 74
4-2-1 磁性微粒間的作用力 ....................................................... 76
4-2-2 磁性流體特性 .................................................................... 78
4-3 磁性流體拋光原理 ...................................................................... 80
4-4 實驗設計與方法 .......................................................................... 81
4-4-1 實驗材料 ............................................................................ 81
4-4-2 實驗方法 ............................................................................ 85
4-5 實驗流程 ...................................................................................... 86
4-6 結果與討論 .................................................................................. 87
4-6-1 水基型磁性流體的配製 ................................................... 87
4-6-1-1 磁性流體輔助拋光單晶矽的效果 .................... 92
4-6-2 油基型磁性流體的配製 ................................................... 93
4-6-2-1 油酸為界面活性劑對懸浮效果的影響 ............ 93
4-6-2-2 防沉劑為界面活性劑對懸浮效果的影響 ........ 94
4-6-2-3 氧化矽為界面活性劑對懸浮效果的影響 ........ 96
4-6-2-4 磁場強度對磁流體黏度的影響 ........................ 98
4-6-3 不銹鋼拋光實驗 ................................................................ 99
4-6-3-1 表面粗糙度分析 .............................................. 100
4-6-3-2 驗證實驗 .......................................................... 101
4-6-4 油基型磁性流體對不銹鋼拋光特性探討 ..................... 103
4-6-4-1 磁極配置方式對表面粗糙度的影響 .............. 103
4-6-4-2 工作間距對表面粗糙度的影響 ...................... 103
4-6-4-3 主軸轉速對表面粗糙度的影響 ...................... 106
4-6-4-4 碳化矽含量對表面粗糙度的影響 .................. 106
4-6-4-5 羰基鐵粉含量對表面粗糙度的影響 .............. 108
4-6-4-6 Fe3O4 對表面粗糙度的影響 ............................ 108
4-7 結論 ............................................................................................ 111
第五章 總結論 ....................................................................................... 112
參考文獻 .................................................................................................. 114
作者簡介 .................................................................................................. 120

                                

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