毫發光二極體(mini light-emitting diodes, mini-LEDs)及微發光二極體(micro light-emitting diodes, micro-LEDs)是現今最具發展潛力的顯示元件，然而不論是作為背光源或是顯示器本身，都存在越來越高的熱管理需求。本研究提出一改良式軟性基板，供可撓式mini-LED及micro-LED使用，以提升其散熱能力，進而延長元件之壽命。本研究實際製備該改良式軟性基板，並以熱傳導係數儀、導熱係數實驗，以及熱模擬模型佐證其導熱係數上升之趨勢；且以X射線螢光光譜儀檢測添加物之實際含量，以確認基板之導熱係數與添加物含量之關係；又以可見光光譜儀量測基板之可見光穿透頻譜，分析其作為發光元件基板的潛力與挑戰。

Mini light-emitting diodes (mini-LEDs) and micro light-emitting diodes (micro-LEDs) are the most promising display components nowadays. Whether it is the backlight unit or the display itself, there is an increasing demand for thermal management. In this study, an improved flexible substrate is proposed as a substrate of the flexible mini-LED or the micro-LED to improve the heat dissipation capability and prolong the life of the device. The improved flexible substrate has been fabricated. The thermal conductivity analyzer, thermal conductivity experiment, and thermal simulation model were used to verify the thermal conductivity. Additionally, X-ray fluorescence spectrometer was used to verify the actual content of the filler and then to confirm the relationship between thermal conductivity of the substrate and its filler content. The visible spectrophotometer was used to measure the transmittance spectrum of the substrate for analyzing its potential and characteristics.

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