以非結晶塑膠熱壓成型法製作微凸球面結構之研究

簡易檢索 / 詳目顯示

回結果列表

研究生：	張煌昌 Huang-Chang Chang
論文名稱：	以非結晶塑膠熱壓成型法製作微凸球面結構之研究 A study of fabrication micro convex spherical structure in amorphous resin through hot embossing
指導教授：	顏炳華 Biing-Hwa Yan
口試委員:
學位類別：	碩士 Master
系所名稱：	工學院 - 機械工程學系在職專班 Executive Master of Mechanical Engineering
畢業學年度：	95
語文別：	中文
論文頁數：	89
相關次數：	點閱：16 下載：0
分享至:	分享至facebook 分享至twitter

查詢本校圖書館目錄查詢臺灣博碩士論文知識加值系統勘誤回報

一般微細產品的製程技術常採用沈積、光微影、蝕刻、雷射加工、LIGA等，製造成本昂貴。本實驗則利用微放電技術，製作半徑0.05mm深0.02mm的微凹球面之模具，再運用熱壓成型機，對非結晶性透明塑膠材料有ABS、PMMA、PC等，以粒重約為0.01g~0.016g，進行微凸球面結構之熱壓塑膠成型。
近年由於光學產業包括、數位相機、傳統相機、攝影器材、光學元件、眼鏡、導光板、背光模組、LCD等各式樣的光學凹凸透視鏡等產品，其所使用的透明塑膠材質大都以PMMA、PC為主軸ABS為輔搭配ABS樹脂混成複合材料，開發業界所需要的新物性。因此本實驗將以ABS、PMMA、PC三種塑膠材料為實驗材料，探討其成型時，溫度、壓力、時間等對塑膠成型之影響。
經由熱壓實驗結果獲知，ABS、PMMA、PC等材料之高精度成型，除上述參數外，冷卻溫度的掌控、微凹球面模具的材質的選用及研磨拋光製程的改善等，對塑膠微凸球面結構之產品，亦有極大的影響。實驗結果顯示適當的加工參數組合，微結構球面之粗糙度可達Ra 0.030μm，且其微形球面之直徑僅約50μm，合乎一般製造導光板為主的光電廠要求。本研究所使用之方法雖然相當簡易，但其微形球面的成型精度良好，將對該領域產業技術的提昇有所助益。

The common MEMS processed technology often limits to deposits, lithography etching, laser processing, LIGA etc, So the production cost is expensive. This experiment uses the micro EDM technology, manufacture mold with radius 0.05mm depth 0.02mm micro concave spherical, using the hot embossing machine formation, and processed has material amorphous resin ABS, PMMA, PC, the grain weight approximately is 0.01g~0.016g, then for micro convex spherical structure use hot embossing formation.
In recent years the optics industry including: digital camera, traditional camera, photographic equipment, optics part, lens, back light mold, and LCD optics of concave convex, almost uses PMMA, PC transparent material. ABS is auxiliary and matches the resin to mix the compound material. Therefore this experiment by ABS, PMMA and PC three kind of plastic materials discusses the formation’s the temperature, the pressure, and time etc, to forming influence the precision.
According to the hot embossing experimental results show that, ABS, PMMA, and PC etc, was high precision material to form , with besides the above parameters, control the cooling temperature , and the micro concave spherical mold quality selects, and grinding polished the system the improvement etc, to product of the micro convex spherical structure, was important influence parameter. The experimental result demonstration suitable processing parameter combination, roughness of the microstructure spherical may reach Ra 0.030μm , its micro shape diameter was approximately 50μm spherical , completes conforms with the general manufacture light guide board of the optics plant request. Although the experimentation method was simple, but its micro shape spherical precision forming was good for industry technology development.

摘要.....................................................Ι
總目錄..................................................III
圖目錄...................................................VI
表目錄....................................................X
第一章 緒論...............................................1
1-1研究動機..........................................1
1-2 研究目的.........................................3
第二章文獻回顧............................................5
2-1熱壓成型技術起源..................................5
2-2文獻回顧..........................................6
第三章塑膠材料成型加工基本原理介紹........................8
3-1各種塑膠材料成型法................................8
3-1-1熱壓成型加工基本原理..........................8
3-1-2熱壓成型材料.................................10
3-1-3熱壓成型步驟.................................11
3-2工程塑膠材料介紹.................................12
3-2-1 ABS工程塑膠基本介紹.........................17
3-2-2 PMMA工程塑膠基本介紹........................17
3-2-3 PC工程塑膠基本介紹..........................18
3-3熱壓成型發生製品不良原因與處理方法...............19
3-4模具方面........................................26
第四章實驗設備、材料及方法..............................28
4-1放電加工實驗設備.................................28
4-1-1微型球面放電實驗方法.........................28
4-1-2實驗參數設定.................................30
4-1-3電解加工.....................................31
4-1-4微凹型球面模穴研磨加工.......................31
4-2熱壓機實驗設備....................................32
4-2-1熱壓機.......................................32
4-2-2雕刻機.......................................34
4-2-3圓柱形模具...................................36
4-2-4 雕刻機研磨模仁緩衝夾具......................37
4-3實驗材料..........................................37
4-4實驗方法－模具設計加工............................38
4-5實驗參數設定......................................42
4-5-1 ABS參數設定.................................42
4-5-2 PMMA參數設定................................43
4-5-3 PC參數設定...................................44
4-6微熱壓成型流程....................................47
4-7實驗流程..........................................50
第五章實驗結果與討論.....................................51
5-1 SKD61微凹球形在模具ABS PMMA PC材料之成型結果.....51
5-1-1塑膠材料ABS成型.............................51
5-1-2塑膠材料PMMA成型............................53
5-1-3塑膠材料PC成型..............................55
5-2 T6鋁合金微凹球形模具在ABS PMMA PC材料之成型材料最佳成型條件.........................................57
5-2-1塑膠材料ABS成型.............................58
5-2-2塑膠材料PMMA成型.............................60
5-2-3塑膠材料PC成型...............................62
5-3 T6鋁合金微凹球形模具運用雕刻機在ABS PMMA PC材料之成型................................................64
5-3-1鋁合金T6模具高轉速研磨加工...................64
5-3-2塑膠材料ABS成型..............................65
5-3-3塑膠材料PMMA成型.............................67
5-3-4塑膠材料PC成型...............................67
5-4溫度對塑膠材料之影響...............................69
5-5影響粗糙度的因素...................................71
5-6影響熱壓成型時間的因素.............................75
5-7保持壓力時間對熱壓成型之影響.......................77
5-8冷卻溫度對熱壓成型之影響...........................79
5-9影響脫模不良的因素.................................82
5-10微球面成型與業界比較..............................84
第六章 結論..............................................85
參考文獻.................................................87

                                

1.曾世昌，微射出成型技術於微機電系統之應用與研究，國科會研究報告成果，1997。
2.財團法人塑膠工業技術發展中心，塑膠e學苑。
3.黃錦鐘譯，放電加工，高立圖書有限公司。
4.光學高分子精密加工技術，工業技術人才培訓計劃講義92年度。
5.精密光學元件設計及製造技術研討會，經濟部工業局93年度。
6.塑膠加工實物，塑膠世界雜誌叢書。
7.塑膠入門，塑膠世界雜誌叢書。
8.楊禮仲，LIGA製程中之微影及熱壓的研究國立清華大學材料科學與工程研究所碩士論文，1997。
9. Heckele, M. Bacher, W.and Muller, K. D."Hot Embossing –the Molding Technigue for Plastic Microstructures”, Microsystem Technology,Vol.4,pp.122-124 (1998).
10. Holger Becker and Heim, U."Hot Embossing as a Method for the Fabrication of Polymer High Aspect Ratio Structure”, Sensor and Actuators A,Vol.83,pp.130-135 (2000).
11.Ong, N. S., Koh, Y. H. and Fu, Y. Q “Microlens Array Produced Using Hot Embosssing Process”,Microelectronic Engineering, Vol.60,pp.365-379 (2002).
12.Terry Koerner, Laurie Brown, Ruixi Xie, Richard D. Oleschuk “Applications of micro hot embossing for optical switch formation”,Sensors and Actuators A, Vol.119, pp.433–440 (2005).
13.Terry Koerner, Laurie Brown, Ruixi Xie, Richard D. Oleschuk
“Epoxy resins as stamps for hot embossing of microstructures and microfluidic channels”,Sensors and Actuators B, Vol.107, pp. 632–639(2005).
14.林信隆編譯，塑膠射出成形。
15.高分子材料，塑膠世界雜誌叢書。
16.工程塑膠全集，塑膠世界雜誌叢書。
17.吳富祥，ABS樹脂系的耐候性改良，高分子工業。
18.ABS+P樹脂規程性質表，泰複合材料股份有限公司。
19.亞克力塑膠原理與實用，塑膠世界雜誌叢書。
20.聚碳酸酯樹脂原理與實用，塑膠世界雜誌叢書。
21.陳宏謨，最新PC工程塑膠的應用，高分子工業。
22.(圖解)射出成型不良原因及對策，塑膠世界雜誌叢書。
23.射出成型機手冊使用者指引，塑膠世界雜誌叢書。
24.射出成型機使用者手冊，塑膠世界雜誌叢書。
25.FAUNC電動式射出機成型機一般概論，世紀貿易公司。
26.Schift,H. C.David, M. Gabriel. J.Gobrechi, L.J. Heydeman, W.Kaiser. S. Koppel and Scandella“Nanoreplication in polymers using hot embossing and injection molding”, Microelectronic Engineering Vol.55 ,pp.171-174 (2000).
27. L.J. Heyderman, H. Schift, C. David, B. Ketterer, M. Auf der Maur, J. Gobrecht “Nanofabrication using hot embossing lithography and electroforming” ,Microelectronic Engineering Vol.57–58, pp.375–380(2001)
28. Miguel Pazos, Juan Baselga, Julio Bravo “Limiting thickness estimation in polycarbonate lenses injection using CAE tools”, Journal of Materials Processing Technology Vol.143–144,pp. 438–441(2003).
29. C.-R. Lin, R.-H. Chen, C. Hung “Preventing non-uniform shrinkage in open-die hot embossing of PMMA microstructures”, Journal of Materials Processing Technology Vol.140, pp. 173–178 (2003)
30. Sihai Chen,Xinjian Yi,Hong Ma“A novel method of fabrication of microlens arrays”,Infrared Physics & Technology Vol.44, pp.133–135 (2003)
31. C.-Y.Chang, S.-Y.Yang, L.-S.Huang, J.-H.Chang “Fabrication of plastic microlens array using gas-assisted micro-hot-embossing with a silicon mold”,Infrared Physics & Technology Vol.48, pp. 163–173(2006)
32. Rean-Der Chien ,“Micromolding of biochip devices designed with microchannels”, Sensors and Actuators A,Vol.128, pp.238–247 (2006).
33.Rean-Der Chien“Hot embossing of microfluidic platform”,International Communications in Heat and Mass Transfer Vol.33, pp. 645 –653 (2006).
34.Seunarine,K.“Optical heating for short hot embossing cycle times”,Microelectronic Engineering Vol.83 ,pp.859–863 (2006).
35.Patrick,W.“Pattern replication in polypropylene films by hot embossing”,Microelectronic Engineering xxx–xxx (2007)

簡易檢索 / 詳目顯示

相關論文