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研究生： 黃俊皓
Chun-hao Huang
論文名稱： 無電鍍鈷基材與無鉛銲料於熱退火下之界面反應研究
Solid state reactions at the interface between SAC305 Pb-free solder and Co-based substrates
指導教授： 吳子嘉
Albert T. Wu
口試委員:
學位類別： 碩士
Master
系所名稱： 工學院 - 化學工程與材料工程學系
Department of Chemical & Materials Engineering
論文出版年： 2014
畢業學年度： 102
語文別： 中文
論文頁數： 72
中文關鍵詞： 無鉛銲料 、固/固 界面反應 、無電鍍鈷 、無電鍍鈀 、大規模剝離
外文關鍵詞： Pb-free solder, Solid state interfacial reaction, Electroless cobalt, Electroless palladium, Massive spalling
相關次數： 點閱：15  下載：0 
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    • 為尋找新的表面處理技術以運用於印刷電路板，含Co及Pd之基材為考量之一。本研究之基材選用以無電鍍Co為基礎的四種不同表面處理系統，分別為無電鍍鈷 (Electroless Cobalt，EC)、無電鍍鈷/浸金 (Electroless Cobalt/Imersion Gold，ECIG)、無電鍍鈷/無電鍍鈀 (Electroless Cobalt/Electroless Palladium，ECEP) 、無電鍍鈷/無電鍍鈀/浸金 (Electroless Cobalt/Electroless Palladium/ Imersion Gold，ECEPIG)。本研究將探討四種不同無電鍍Co系統與Sn-3.0Ag-0.5Cu無鉛銲料在固/固之界面反應變化。
    研究結果顯示無電鍍Co系統在固/固界面反應中，因受到介金屬化合物成長與剝離於界面相互競爭之影響，介金屬化合物總厚度呈現不規則變化。銲料與(Co,Cu)Sn3或(Co,Cu,Pd)Sn3 之間的界面上偏好生成(Co,Cu)6Sn5或(Co,Cu,Pd)6Sn5。隨著退火溫度上升或退火時間增加，(Co,Cu)6Sn5或(Co,Cu,Pd)6Sn5厚度也隨之增加。

    Surface finishes containing Co and Pd are new candidates for printed circuit boards. This study investigated the solid state interfacial reaction between Sn-3.0Ag-0.5Cu Pd-free solders and four different Co-based surface finishes, such as electroless Co (EC), electroless Co/immersion Au (ECIG), electroless Co/electroless Pd (ECEP), and electroless Co/electroless Pd/immersion Au (ECEPIG).
    The results showed that the thickness of the total intermetallic compound thickness could be affected by the spalling and the growth of the compounds in four different Co-based surface finishes. (Co,Cu)6Sn5 and (Co,Cu,Pd)6Sn5 would form at the interfaces between the solder and (Co,Cu)Sn3 or (Co,Cu,Pd)Sn3. Prolonging the aging time or raising the aging temperature would result in the increase of the (Co,Cu)6Sn5 and (Co,Cu,Pd)6Sn5.

    中文摘要 I Abstract II 致謝 III 目錄 IV 圖目錄 VI 表目錄 IX 1-1 前言 1 1-2 電子構裝技術 1 1-2-1 構裝層級 1 1-2-2 構裝技術 2 1-2-3 球柵陣列封裝 (Ball grid array，BGA) 3 1-2-4 銲錫凸塊 4 1-3 界面反應 6 1-4 不同銲料與Co基材之固相/固相界面反應 7 1-4-1 Sn/Co 的固相/固相界面反應 7 1-4-2 Sn-Cu/Co 的固相/固相界面反應 10 1-4-3 Sn-Ag/Co 的固相/固相界面反應 11 1-4-4 Sn-Ag-Cu/無電鍍Co 的固相/固相界面反應 11 1-5-1 Ni-P/Au與Co-P/Au之界面反應 13 1-5-2 化學鎳金(ENIG)與化學鎳鈀金(ENEPIG)之界面反應 13 1-5-3無電鍍鈷(EC)與無電鍍鈷鈀(ECEP)之界面反應 16 1-6 大規模剝離現象之文獻回顧 17 1-6-1系統有限的反應元素 17 1-6-2 降低界面能 18 1-7 研究目的 19 第二章 實驗方法 20 2-1 EC、ECIG、ECEP及ECEPIG基材製備 20 2-2 無鉛銲料製備 21 2-3 液相/固相界面反應 21 2-4 固相/固相界面反應 22 2-5 金相處理與試片分析 22 2-5-1 掃描式電子顯微鏡 (Scanning Electron Microscope，SEM) 23 2-5-2 電子微探儀 (Field-Emission Electron Probe Microanalyzer，FE-EPMA) 23 2-6 實驗流程圖 24 第三章 結果與討論 25 3-1 無鉛銲料與EC、ECIG、ECEP及ECEPIG基材之液相/固相界面反應 25 3-2 無鉛銲料與EC、ECIG、ECEP及ECEPIG基材之固相/固相界面反應 31 3-2-1 固相/固相界面反應之成分鑑定 31 3-2-2 EC、ECIG與ECEP基材與Sn-3.0Ag-0.5Cu於90oC退火不同天數之固相/固相界面反應 34 3-2-3 EC、ECIG與ECEP基材與Sn-3.0Ag-0.5Cu於120oC退火不同天數之固相/固相界面反應 38 3-2-4 EC、ECIG與ECEP基材與Sn-3.0Ag-0.5Cu於150oC退火不同天數之固相/固相界面反應 41 3-2-5 ECEPIG基材與Sn-3.0Ag-0.5Cu退火不同天數與溫度之固相/固相界面反應 43 3-3 無鉛銲料固相/固相界面反應生成之介金屬化合物探討 47 3-3-1 (Co,Cu)Sn3與(Co,Cu,Pd)Sn3 介金屬化合物的成長 49 3-3-2 U- (Cu,Co)6Sn5與U- (Cu,Co,Pd)6Sn5介金屬化合物的成長 50 3-3-3 (Cu,Co)6Sn5與(Cu,Co,Pd)6Sn5介金屬化合物中Cu的來源 51 3-3-4 Ag3Sn對系統的影響 53 3-3-5 B-Cu6Sn5、M-IMC與B-IMC的介金屬化合物成長 53 第四章 結論 54 參考文獻 56

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