本論文進行兩部分實驗，第一部分是液態Sn-3.5Ag與Ni之反應，第二部分是Sn-3.5Ag銲錫球與BGA基板之反應。其中Sn-3.5Ag為歐美電子業界認為最具潛力之無鉛銲料候選材料之一，而Ni則常用於印刷電路板及BGA之墊層。本論文使用之BGA基板銲接之墊層，已經過鍍Au及鍍Ni的表面處理。
第一部分進行Ni與液態Sn-3.5Ag銲料之反應，反應於250、280、310及340℃四個溫度進行，反應時間1∼120小時不等。此部分我們分為兩組實驗，第一組為Immersion實驗，以Ni片插入5 g熔融銲料中反應。第二組為Droplet實驗，將10 mg銲料滴在Ni片上反應。這兩組反應最大的差別在於反應物相對質量之多寡，以及反應後產生之銲料中Ni濃度的高低不同，而造成界面反應的差異。
在液態Sn-3.5Ag與Ni的Immersion實驗中，反應溫度為250oC時，在Ni與Sn-3.5Ag之間的界面只生成一層介金屬，由EPMA組成分析得知為Ni3Sn4。反應溫度在280∼340oC時，除了Ni3Sn4生成以外，還有另外兩層很薄的介金屬在Ni3Sn4與Ni之間的界面生成，厚度大約1∼2

[ANH]S. Anhock, H. Oppermann, C. Kallmayer, R.
Aschenbrenner, L. Thomas, H. Reichl, IEEE/CPMT Bertin
Int’l Electronics Manufacturing Technology Symposium,
7, p.156, 1998.
[AVI]R. R. de Avillez, M. F. S. Lopes and A. L. M Silva,
J. Mater. Sci. Eng A, 205, p.209, 1996.
[BAD]S. Bader, W. Gust and H. Hieber, Acta Metall. Mater,
43, p.329, 1995.
[BEE]J. A. van Beek, S. A. Stolk and F. J. J. van Loo, Z
Metallkde, 73, p.441, 1982.
[BLA]H. D. Blair, T. Pan and J. M. Nicholson, Electronic
Components and Technology Conference, 6, p.259, 1998.
[BRA]E. Bradley and K. Banerji, IEEE Trans. Compon. Pack.
Manufact. Tech. B, 19, p.320, 1996.
[CHE]C. P. Chen and Y. A. Chang, Diffusion in Ordered
Alloys, ed. B. Fultz, R. W. Cahn, and D. Gupta, TMS,
Warrendale, PA, p.169, 1993.
[CHO]W. K. Choi and H. M. Lee, J. Eletronic Materials, 28,
p1251, 1999.
[DOD].G. Dody and T. Burnette, Surf. Mount. Tech, p.39,
May, 1996.
[DYS]B. F. Dyson, J. of Applied Physics, 37, 6, p.2375,
1966.
[GLA]J. Glazer, Int. Mater. Rev., 40, p.65, 1995.
[GUP]Y. P. Gupta, The Properties of Liquid Metals,
reprints from Adv. Phys., 16, 1967. Taylor &Francis,
London.
[GUR]D. Gur and M. Bamberger, Acta Meter., 46, p.4917,
1998.
[HAR1]W. B. O’Hara and W. C. Lee, Surf. Mount. Tech.,
p.44, Jan, 1996..
[HAR2]W. B. O’Hara and W. C. Lee, Int. J. Microcircuits
and Elect. Packaging, 19, p.190, 1996.
[HO1]C. E. Ho, Y. M. Chen, and C. R. Kao,
“Dissolution and reaction kinetics of the solder-ball
pads in BGA during reflow soldering,” submitted to
Journal of Electronic Materials.
[HO2]C. E. Ho, R. Zheng, Y. M. Chen, and C. R. Kao,
“Formation and Migration of (AuxNi1-x)Sn4 in solder
Joints of Ball-Grid-Array Packages with the Au/Ni
Surface Finish.” Submitted to Journal of electronic
[KAN1]S. K. Kang and V. Ramachandran, Scripta Metall., 14,
p.421, 1980.
[KAN2]S. K. Kang, R. S. Rai and S. Purushothaman, J.
Electron. Mater., 25, p.1113, 1996.
[KAO]C. R. Kao, Mater. Sci. Eng. A, 238, p.196, 1997.
[KAR]I. Karakaya and W. T. Thompson, Bull. Alloy Phase
Diagrams, 8, 1987.
[KIM]H. K. Kim, H. K. Liou and K. N. Tu, J. Appl. Phys.
Lett., 66, p.2337, 1995.
[LEE1]M. S. Lee, C. M. Liu and C. R. Kao, J. Electron.
Mater., 28, p.57, 1999.
[LEE2]M. S. Lee, C. Chen and C. R. Kao, J. Chem. Mater.,
11, p.292, 1999.
[LEE3]N. C. Lee, Soldering and Surface Mount Tech., 6,
p.65, 1997.
[LEE4]N. C. Lee，「1998先進電子封裝技術趨勢研討會」講義，新
竹，p.8/1-8/8，1998。
[MA]C. H. Ma and R. A. Swalin, Acta Meter., 8, p.388,
1960.
[MAR]S. Martelli, G. Mazzone and M. Vittori-Antisari, J.
Mater. Res., 6, p.499, 1991.
[MAT]G. S. Matijasevic, C. C. Lee and C Y. Wang,
Thin Solid Films, 223, p.276, 1993.
[MEI1]Z. Mei, P. Gallery, D. Fisher, F. Huw and J. Glazer,
Adv. Electron. Pack., 2, p.1543, 1997.
[MEI2]Z. Mei, M. Kaufmann, A. Eslambolchi and P. Johnsn,
Eletronic Components and Technology Conference, 6,
p.952, 1998.
[NAS]P. Nash, Bulletin of Alloy Phase Diagram, 6, p.345,
1985.
[NCM]Lead-Free Solder Project Final Report, NCMS Report
0401RE96, National Center for Manufacturing Sciences,
3025 Boardwalk, Ann Arbor, Michigan, 1997.
[PET]G. Petzow and G Effenberg, Ternary Alloy, VCH
Verlagsgesellschaft, WEINHEIM, GERMANY, 1, 239-249,
1988.
[PLU]W. J. Plumbridge, J. Mater. Sci,. 31, p.2501, 1996.
[RID]E. Rideout, 1994 IEEE/CPMT Int. Elect. Manufact.
Tech. Symp., p.388, 1994.
[ROM]B. M. Romenesko, Int. J. Microcircuit Electron.
Pack., 19, p.64, 1996.
[SIN]M. Singleton and P. Nash, Bull. Alloy Phase Diagrams,
8, 1987.
[STE]T. P. Stefano and S. I. Wakabayashi, Surf. Mount.
Tech. p.52, March, 1995.
[TOM]W. J. Tomlinson and H. G. Rhodes, J. Mater. Sci., 22,
p.1796, 1987.
[WAS1]R. J. Wassink, Soldering in Eelectronics,
Electrochemical Pub. Ltd., p.99, 1984.
[WAS2]R. J. Wassink, Soldering in Eelectronics, 2nd ed.,
Electro-chemical Pub. Ltd., p.523, 1989.
[唐和明]電子與材料，創刊號，1999。
[陳琪]陳琪碩士論文，國立中央大學化工所，1999。
[何政恩1]何政恩、高振宏，中國材料學會1998年年會論文
集，[H]，p.730，1998。
[何政恩2]何政恩、蕭本俐、高振宏，中國材料學會1999年年會論文集，
H43，1999。
[蕭本俐]蕭本俐，中國材料學會1999年年會論文集，1999。
[劉家明]劉家明，中國材料學會1999年年會論文集，1999。