在高效能的電子系統中，處理器的數目越來越多，晶片的速度越來越快，但系統的性能被晶片間相互連結的金屬線路所局限，在這類系統中，光學連結會被考慮來取代電子連結，因為光學連結對頻寬的高容量可降低系統的性能受線路長度的影響。聚合物光波導因為能使成本降低、可得較高佈線密度且有機會與電路板製程整合，所以一直是光波導材料的重點研究對象。
本研究所使用的EpoCore 和EpoClad 是以含環氧基的聚合物為基本所發展的光阻劑。使用作為核心材料的EpoCore和作為覆蓋隔離的EpoClad，可在標準電路板技術和量產設備下製作熱穩定性高的光波導產品。
在光波導線路製作與量測後，我們得到光波導的平均傳輸損耗約為0.45dB/cm ， 達到我們所訂定之規格(0.5dB/cm) 。為了後續將光波導線路設計於印刷電路板內層，在搭配VSCEL與PD後可進行二維的光訊號傳遞，本研究第二部分針對具有45°鏡面的光波導線路進行零件高度、鏡面角度與粗糙度的光學模擬，同時彙整45°鏡面的製作方法供後續研究參考。

With the increasing of the number of processors and the operational speed, electronic interconnect suffers attenuation, cross talk, power consumption, with degrades the performance of high speed transmission systems. Optical interconnects, on the contrary, are being considered to replace electrical interconnects due to their high bandwidth capacity, immunity to electromagnetic interference, low cost and sufficiently light weight. Polymer waveguides are attractive candidates as optical interconnect media since their capability to enable low-cost and high-density interconnects, and can be easily integrated into current organic board-level processes.
EpoCoreTM and EpoCladTM are chemically strengthened photoresists based on multifunctional oligomers containing epoxy groups. Using EpoCore as core material and EpoClad as cladding, thermally stable optical waveguides are fabricated, via standard circuit board fabrication technology.
The average propagation loss of the waveguide is estimated to be 0.45dB/cm; at wavelength of λ=850nm. In order to access whether the waveguide can be made on the inner large of the PCB we simulate the propagation characteristics through the linkage from the VSCEL, 45 degree mirror, to the PD. Variousparamters such as the height of the VCSEL and PD,angle of the mirror,and surface roughness are all taken in to account.
It is concluded that the alignment tolerance can be made less stringent if the effective area of the PD can be made larger (0.2 mm x 0.2mm) and the Diverging angle of the VCSEL can be made smaller (8 degree).

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