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研究生： 陳碩鴻
Shuo-Hung Chen
論文名稱： 溫度循環對於電子產品之破壞效應評估
指導教授： 黃俊仁
Jiun-ren Hwang
口試委員:
學位類別： 碩士
Master
系所名稱： 工學院 - 機械工程學系
Department of Mechanical Engineering
畢業學年度： 88
語文別： 中文
論文頁數： 134
中文關鍵詞： 溫度循環 、溫度範圍 、溫變率 、表面黏著
外文關鍵詞： thermal cycling, temperature range, temperature rate of change, SMT
相關次數： 點閱：11  下載：0 
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    • 實驗結果顯示，在電子元件方面，溫度循環數、溫度範圍及溫變率的增加皆會使發光二極體（LED）的失效率提高，但對於碳膜電阻、電晶體及數位IC的影響則有限。在模組方面，本研究規劃的溫度循環數、溫度範圍及溫變率等實驗條件對於實驗所使用的小型電子電路模組的失效率影響不大。而在SMT銲接點方面，銲接點的拉伸強度會隨著溫度循環數的增加而線性下降，也會隨著溫度範圍的增加而以反冪次方式下降，且當溫變率越高，則SMT銲接點的拉伸強度愈低，
    此外，本研究亦提出修正型反冪次方程式及修正型Hughes方程式，將SMT銲接點在不同溫度範圍及溫變率下的拉伸強度，迴歸得到拉伸強度-溫度範圍-溫變率-循環數的關係式。另外由金相顯微鏡觀察中得知，SMT銲接點之強度退化機構為引腳與銲錫接合面上產生的裂縫。

    摘要I 誌謝II 總目錄III 圖目錄V 表目錄X 符號說明XI 壹、緒論1 1- 1 研究動機與目的1 1- 2 文獻回顧2 1-2-1國內相關重要文獻2 1-2-2國外相關重要文獻3 貳、理論說明6 2-1溫度循環試驗6 2-1-1溫度櫃調節溫度的方式7 2-1-2溫度循環試驗參數之影響9 2-1-3構裝組件在溫度循環下之行為13 2-1-4溫度循環所造成之熱疲勞13 2-2 IC構裝及接點銲接14 2-2-1電子元件接點之銲接方式15 2-2-2電子元件銲接點之破壞機構15 2-3銲錫特性16 2-3-1銲錫的機械性質17 2-3-2銲錫的溫度特性18 2-3-3環境對於銲接點特性之影響18 2-4熱膨脹係數之影響20 2-4-1熱膨脹係數對於銲接點之影響21 2-5資料的統計分析型態22 2-5-1可靠性數據與機率紙26 2-5-2 Weibull環境應力-強度模式修正27 2-6溫度循環效應的數學模式29 參、實驗設備與步驟36 3-1試件規格36 3-2儀器設備37 3-3溫度循環試驗之規劃38 3-3-1失效的定義與失效判定條件39 3-4實驗步驟40 3-4-1電子元件及模組方面之實驗步驟41 3-4-2銲接點拉伸強度試驗之步驟41 3-4-3溫度循環試驗應注意事項42 3-5 SMT銲接點拉伸強度資料處理及分析43 肆、結果與討論44 4-1溫度櫃預設溫度與試件溫度之比較44 4-2溫度循環對於小型電子電路模組之影響44 4-3溫度循環對於SMT銲接點之影響45 4-3-1循環數的影響46 4-3-2溫度範圍的影響47 4-3-3溫變率的影響49 4-4 SMT銲接點破壞機構的探討51 4-5 SMT銲接點強度退化之數學模式52 4-5-1拉伸強度-溫度範圍-溫變率-循環數關係式52 4-5-2拉伸強度-溫度範圍-溫變率-循環數關係式之應用55 伍、結論與未來研究方向56 5-1結論56 5-2未來研究方向57 參考文獻58 附錄A 最小平方差法133

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