藉由熱管原理中流體在高溫區受熱時，會造成密度變小，比重變 輕，因而往上升，相對的，比較冷的流體會因為密度較大，比重較重， 因而往下沉取代往上升的部分。等到較冷的流體受熱溫度升高後又會 在次往上升，此上下交替現象即是形成能量的對流傳遞。以此原理對 燈具進行熱循環式散熱。並在模擬時設定各項調變因子和參數，利用 COMSOL Multiphysics 模擬軟體進行模擬，並取得組模擬結果，分析 各組結果了解如何取得最好的熱管裝置設計以降低 LED 燈具之最高 溫度。初始設計模擬可得狀況之最高溫度為 46.9℃，所得之最佳設計 參數利用 COMSOL Multiphysics 模擬，可預測最佳設計參數狀況之 最高處溫度為 LED chip 表面處 40.8℃，鋁基板處溫度 28.2℃～30℃ LED 燈罩表面處溫度 30℃～32℃，主要燈具部分的鋁基板和 LED 燈罩 表面最高溫度獲得下降。可以大幅降低鋁基板和燈具的溫度，以達到 良好的散熱效果，希望對 LED 燈具散熱設計有所幫助。

By the principle of the fluid of heat pipe heated in the high temperature
area, the density and the ration become lower; therefore, the temperature
goes higher. On the contrary, the high density and ration of the cold fluid
goes down, replacing the rising part. The cold fluid goes up again when
heated. The alternating phenomena lead to convective transfer of capacity
formation. According the principle, the thermal cycling is carried out on
lamps and lanterns. In addition, each of the modulation factor and
parameter is set during simulation. The result of simulation is received by
using the simulation software, COMSOL Multiphysics. To analyze the
result of each group helps to understand how to obtain the most advanced
heat pipe device and to lower the highest temperature and LED lamp. The

highest temperature is 46.9℃ in the beginning of designed simulation.

temperature of LED chip, 40.8℃, and aluminum substrate , 28.2℃～30℃,

and the surface of lamps and lanterns, 30℃～32℃. Therefore, the highest

temperature decreases on the aluminum substrate of the main part of lamps
and lanterns and the surface of LED. Consequently, the temperature of
aluminum substrate declines dramatically to attain the fine effects of heat
dissipation, beneficial to the cooling design of LED.

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